CLP-137-02-H-D-P

CLP-137-02-H-D-P is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Samtec Inc.. Its product description is LOW PROFILE DUAL-WIPE SOCKET, .0. Review the specifications below when checking this part for your BOM.

Headers, Receptacles, Female Sockets specifications for CLP-137-02-H-D-P

• Description：LOW PROFILE DUAL-WIPE SOCKET, .0
• Series：CLP
• Mfr：Samtec Inc.
• Package：-
• Connector Type：Receptacle
• Contact Type：Female Socket
• Style：Board to Board
• Number of Positions：74
• Number of Positions Loaded：All
• Pitch - Mating：0.050" (1.27mm)
• Number of Rows：2
• Row Spacing - Mating：0.050" (1.27mm)
• Mounting Type：Surface Mount
• Termination：Solder
• Fastening Type：Push-Pull
• Contact Finish - Mating：Gold
• Contact Finish Thickness - Mating：30.0µin (0.76µm)
• Insulation Color：Black
• Insulation Height：0.084" (2.14mm)
• Contact Length - Post：-
• Operating Temperature：-55°C ~ 125°C
• Material Flammability Rating：UL94 V-0
• Contact Finish - Post：Gold
• Mated Stacking Heights：-
• Ingress Protection：-
• Features：Pick and Place
• Current Rating (Amps)：3.3A per Contact
• Voltage Rating：240VAC, 330VDC

Headers, Receptacles, Female Sockets datasheet and documents for CLP-137-02-H-D-P

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