SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The CPAT-132-D1-G-13AW is a Samtec connector component belonging to the CPAT series. It functions as a high-density terminal strip designed for surface mount applications. The part features a dual-row configuration with 32 positions per row, resulting in a total of 64 contacts. The pitch between contacts is standardized at 2.54 mm (0.100 inches). The contact system utilizes .025 inch square posts, which are gold-plated to ensure reliable electrical performance and corrosion resistance. The termination method is specified as surface mount, allowing for automated assembly on printed circuit boards. The housing material is polyester, providing structural integrity and insulation. This specific model includes an angled tail design, indicated by the '13AW' suffix, facilitating specific board-to-board or cable-to-board interconnection geometries within compact electronic assemblies.
Verify the exact pin count and row configuration against the official Samtec datasheet before procurement. Confirm that the surface mount footprint matches the target PCB layout dimensions. Ensure compatibility with the mating socket or header components regarding height and contact alignment. Check for any specific environmental compliance requirements such as RoHS or REACH status relevant to the final product application. Validate the angled tail orientation to prevent mechanical interference during assembly.
Select this component when a dual-row surface mount solution with .100 inch pitch is required. The gold plating offers superior conductivity and durability compared to tin options. Consider the angled tail design if space constraints or routing paths necessitate non-standard termination angles. Evaluate the mechanical stability provided by the square post system for high-vibration environments. Compare against single-row alternatives if higher density is not critical.
This part belongs to the CPAT series from Samtec, which specializes in high-performance interconnect solutions. The series is known for its robust construction and suitability for demanding applications. The CPAT series typically offers various configurations to meet diverse spacing and mounting needs. Understanding the broader series characteristics helps in selecting compatible mating parts and ensuring system-level interoperability.
Direct substitutes may include other Samtec CPAT variants with similar pitch and row counts but different tail configurations. Cross-reference with SS or ESS series parts if through-hole mounting is acceptable instead of surface mount. Verify that any replacement maintains the same contact plating and housing material specifications to ensure equivalent performance.
The contact pitch is 2.54 mm (0.100 inches).
It uses surface mount termination.
The contacts are gold-plated.

Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read More
In the world of electronics, memory components play a critical role in system performance—and DRAM (Dynamic Random-Access Memory) is one of the most widely…
Read MoreON Semiconductor (onsemi), a global leader in intelligent power and sensing technologies, has announced plans to implement price adjustments for select product lines, effective…
Read More
Explore electronic component types, functions, packages and datasheets. Learn selection, replacement and BOM checks before ordering parts for your PCB.
Read MoreSeptember 16, 2026 – Global — Leading semiconductor manufacturer ON Semiconductor (onsemi, NASDAQ: ON) has officially issued a formal price adjustment letter to global…
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read More
Understand how a comparator switches at a voltage threshold, why hysteresis prevents chatter, and which output and input specs matter.
Read More
Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
Read More
Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read More
Learn why PTC resistance rises with temperature, how it differs from NTC, and which ratings matter for sensing and protection.
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More