CPT30050

Diode Arrays Overview

The CPT30050 is a Schottky PowerMod rectifier module manufactured by Microsemi. It features a common cathode configuration with two diodes per package. The device supports an average forward current of 150A per leg and 300A per package, with a maximum repetitive peak reverse voltage of 50V. Maximum surge current is rated at 2000A. Forward voltage is specified as 0.76V at 200A and 125°C. Thermal resistance from junction to case is 0.40°C/W.

Diode Arrays Feature Summary

• Schottky barrier technology for high-speed switching
• Guard ring protection for enhanced reliability
• Nickel-plated copper baseplate for thermal management

Diode Arrays Applications

• High-frequency DC-DC converters
• Power factor correction circuits
• Uninterruptible power supplies (UPS)
• Industrial motor drives

Diode Arrays Procurement Notes

Verify the specific suffix code on the component marking to confirm the internal configuration. Suffix A indicates a common anode arrangement, while D denotes a doubler configuration. Ensure the procurement order explicitly states the required pinout variant to prevent installation errors in existing designs.

Diode Arrays Selection Notes

Select this component based on the 50V reverse voltage rating and 150A continuous current capability per leg. Evaluate the thermal resistance of 0.40°C/W against the system's heat sink capabilities. Confirm that the operating junction temperature range of -55°C to 175°C aligns with the environmental requirements of the target application.

Diode Arrays Part Context

This part belongs to the CPT300xx series of Schottky PowerMod modules. It shares mechanical dimensions and mounting specifications with other variants in the family, such as the CPT30035 and CPT30040. The primary differentiator across the series is the maximum repetitive peak reverse voltage rating.

Diode Arrays Replacement Considerations

Cross-reference with industry equivalents like the 301CNQ050 or MBRP30050CT. Verify that substitute components match the MD3CC package outline and maintain equivalent thermal resistance values to ensure compatibility with existing cooling infrastructure.