CSRG0530B02-ICKD-R

Overview

The CSRG0530B02-ICKD-R is a Bluetooth component manufactured by Qualcomm. It utilizes a WLCSP package with dimensions of 3.1642 x 3.7042 x 0.6mm and features 54 balls. The device operates within the Bluetooth wireless communication standard.

Feature Summary

• Supports Bluetooth wireless communication protocols
• Utilizes Wafer-Level Chip Scale Package (WLCSP) technology for compact integration

Applications

• Bluetooth-enabled consumer electronics
• Wireless peripheral devices
• IoT modules requiring Bluetooth connectivity

Procurement Notes

Verify the specific revision suffix and packaging configuration against official Qualcomm documentation before procurement. Ensure compatibility with the target PCB footprint and soldering profile. Confirm that the component meets all required regulatory standards for the intended market deployment.

Selection Notes

Select this component when a low-profile Bluetooth solution is required for space-constrained designs. Consider the WLCSP form factor for high-density board layouts. Evaluate the 54-ball interface requirements against available routing resources on the primary circuit board.

Part Context

This part belongs to Qualcomm's portfolio of wireless connectivity components. It is designed for integration into mobile and portable devices requiring short-range wireless communication capabilities. The component supports standard Bluetooth functionality within the specified physical package constraints.

Replacement Considerations

Consult official Qualcomm substitution guides for verified alternatives. Cross-reference pinouts and electrical characteristics carefully. Generic equivalents may not match the specific performance or form factor requirements.