CTCB1812F-125P

Chip Ferrite Bead Overview

The CTCB1812F-125P is a single-line power line ferrite bead manufactured by Central Technologies in an 1812 (4532 Metric) surface-mount package. It provides an impedance of 125 Ohms at 100 MHz with a maximum DC resistance of 30 milliohms and supports a current rating of 4 Amperes. The component operates within a temperature range of -55 °C to +125 °C and is available in ±25% tolerance.

Chip Ferrite Bead Feature Summary

• Multi-layer chip construction for high-frequency noise suppression
• Designed for power line applications with low DC resistance
• RoHS compliant and lead-free manufacturing

Chip Ferrite Bead Applications

• Power supply input filtering
• High-speed digital signal line termination
• EMI suppression in portable electronics

Chip Ferrite Bead Procurement Notes

Verify the specific suffix designation, as 'S' variants may indicate obsolete status while 'P' denotes active production. Confirm RoHS compliance documentation matches current regulatory requirements. Ensure the 1812 footprint aligns with PCB design constraints before finalizing procurement orders.

Chip Ferrite Bead Selection Notes

Select this component when a 125 Ohm impedance at 100 MHz is required for power lines carrying up to 4 Amperes. The low 30 milliohm DC resistance minimizes voltage drop. Verify that the 1812 package size fits the assembly space and that the ±25% tolerance meets circuit noise suppression specifications.

Chip Ferrite Bead Part Context

This part belongs to the CTCBF series of multi-layer ferrite beads from Central Technologies. These components are engineered for EMI/RFI suppression in compact electronic designs. The series offers various impedance values and package sizes to accommodate different frequency and current requirements in modern consumer and industrial devices.

Chip Ferrite Bead Replacement Considerations

Direct substitutes include other 1812 ferrite beads with 125 Ohm @ 100 MHz impedance and 4A current ratings. Verify pin compatibility and thermal characteristics. Cross-reference with manufacturers offering similar multi-layer chip bead technologies for equivalent performance metrics.