Memory IC CY7C1525KV18-300BZC product image

CY7C1525KV18-300BZC

$126.36
  • Description:IC SRAM 72MBIT PARALLEL 165FBGA
  • Series:-
  • Mfr:Cypress Semiconductor Corp
  • Package:Bulk

SKU:e9cc91b7c150 Category: Brand:

  
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CY7C1525KV18-300BZC is listed in the Memory IC range at ChipApex. The manufacturer field lists Cypress Semiconductor Corp. Its product description is IC SRAM 72MBIT PARALLEL 165FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for CY7C1525KV18-300BZC

  • Description:IC SRAM 72MBIT PARALLEL 165FBGA
  • Series:-
  • Mfr:Cypress Semiconductor Corp
  • Package:Bulk
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, QDR II
  • Memory Size:72Mbit
  • Memory Organization:8M x 9
  • Memory Interface:Parallel
  • Clock Frequency:300 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FBGA (13x15)
  • Access Time:-

Memory IC datasheet and documents for CY7C1525KV18-300BZC

CY7C1525KV18-300BZC

Memory IC Overview

The CY7C1525KV18-300BZC is a 72-Mbit QDR II SRAM with an 8M x 9 organization. It supports a maximum clock frequency of 300 MHz and operates within a voltage range of 1.7 V to 1.9 V. The device features separate independent read and write data ports, enabling concurrent transactions without bus turnaround delays. It utilizes double data rate interfaces on both ports for high bandwidth. The component is housed in a 165-ball FBGA package.

Memory IC Feature Summary

  • Supports concurrent read and write operations through separate dedicated data ports
  • Features double data rate interfaces on both read and write ports for maximized throughput
  • Includes echo clocks (CQ and CQ) to simplify data capture in high-speed systems
  • Provides programmable output impedance via the ZQ pin for system bus matching

Memory IC Applications

  • High-bandwidth networking equipment
  • Telecommunications infrastructure
  • Data acquisition systems

Memory IC Procurement Notes

Verify the specific speed grade suffix matches the required operational frequency. Confirm the package type corresponds to the board layout requirements. Check RoHS compliance status as manufacturing sources may vary between Infineon and Cypress. Ensure the DOFF pin configuration aligns with the desired latency mode for the target application design.

Memory IC Selection Notes

Select this component when a 72-Mbit capacity with an 8-bit word width plus parity is required. Choose based on the necessary clock frequency to ensure timing margins are met. Consider the 165-ball FBGA footprint constraints during PCB design. Evaluate power consumption specifications against the system thermal budget for continuous operation.

Memory IC Part Context

This part belongs to the CY7C1525KV18 series of synchronous pipelined SRAMs. The series includes variants with different access speeds and organizations. These devices utilize QDR II architecture to eliminate data contention inherent in common I/O designs. The family supports depth expansion through port select inputs for larger memory configurations.

Memory IC Replacement Considerations

CY7C1525KV18-333BZXC offers a higher clock frequency of 333 MHz. CY7C1525V18-200BZC provides a lower speed option at 200 MHz. Both alternatives maintain the same 8M x 9 organization and 165-ball FBGA package form factor.

CY7C1525KV18-300BZCCY7C1525KV18-300BZC
$126.36
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