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CY7C1613KV18-300BZI is listed in the Memory IC range at ChipApex. The manufacturer field lists Cypress Semiconductor Corp. Its product description is IC SRAM 144MBIT PAR 165FBGA. Review the specifications below when checking this part for your BOM.
The CY7C1613KV18-300BZI is a 144-Mbit QDR II SRAM with an 8 M × 18 organization. It supports a maximum operating frequency of 300 MHz and utilizes a four-word burst architecture. The device features separate read and write ports, double data rate interfaces, and echo clocks for precise timing. It operates with a core voltage of 1.8 V and I/O voltages ranging from 1.4 V to 1.9 V. The component is housed in a 165-ball FBGA package.
Verify that the specific ordering suffix matches the required speed grade and package variant. Confirm lead-free status if mandated by assembly specifications. Ensure the DOFF pin configuration aligns with the desired PLL operation mode. Validate that the selected part number corresponds to the correct density and organization for the target design.
Select this component when a 144-Mbit capacity with an 18-bit data width is required. Choose this model for applications needing 300 MHz performance levels. Consider the QDR II architecture for designs requiring simultaneous bidirectional data flow without bus turnaround delays. Verify compatibility with existing clocking schemes and voltage domains.
This device belongs to the Cypress Semiconductor QDR II SRAM family. It shares architectural similarities with the CY7C1615KV18 but differs in organization and density. The series is designed for synchronous pipelined memory applications requiring high throughput and low latency.
CY7C1613KV18-300BZXC
Asserting DOFF high enables 1.5-cycle read latency. Asserting it low configures the device to operate in QDR I mode with one-cycle read latency.
The ZQ pin is used for output impedance matching. An external resistor connects this pin to ground to tune the output drivers to the system bus impedance.
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