CYW20738A1KFBGT

RF Transceiver ICS Overview

The CYW20738A1KFBGT is an Infineon Technologies RF transceiver integrated with a microcontroller, designed for Bluetooth v4.0 applications operating at 2.4 GHz. It is housed in a 64-VFBGA package and complies with RoHS standards. The component functions as an IC RF TxRx combined with MCU capabilities, supporting wireless communication protocols within the specified frequency band.

RF Transceiver ICS Feature Summary

• Integrates RF transceiver functionality with a microcontroller unit
• Supports Bluetooth v4.0 wireless communication protocol
• Operates within the 2.4 GHz industrial, scientific, and medical (ISM) frequency band

RF Transceiver ICS Applications

• Bluetooth-enabled wireless peripherals
• IoT sensor nodes requiring low-power connectivity
• Embedded systems with integrated radio control requirements

RF Transceiver ICS Procurement Notes

Verify component authenticity through authorized Infineon distributors or certified partners. Confirm datasheet revisions match design specifications. Ensure ESD handling procedures are followed during assembly. Check for lifecycle status updates to avoid obsolescence risks in long-term production planning.

RF Transceiver ICS Selection Notes

Select this component when Bluetooth v4.0 compatibility is required alongside integrated MCU processing. Consider the 64-VFBGA package constraints for PCB layout. Evaluate power consumption profiles against system battery life requirements. Ensure antenna design aligns with 2.4 GHz operational parameters.

RF Transceiver ICS Part Context

This part belongs to Infineon's AIROC family of wireless connectivity solutions. It combines radio frequency front-end capabilities with digital processing cores. The integration reduces bill-of-materials complexity compared to discrete RF and MCU combinations. It targets compact consumer electronics and industrial IoT form factors.

RF Transceiver ICS Replacement Considerations

Consult official Infineon documentation for direct pin-to-pin replacements. Verify firmware compatibility if substituting within the same product line. Cross-reference package dimensions and thermal characteristics before implementation.