D2516ACXGXGRK-U

Memory IC Overview

The Kingston Technology D2516ACXGXGRK-U is a 4 Gbit DDR4 SDRAM component organized as 256M words by 16 bits. It utilizes a 96-ball FBGA package and operates at a data rate of 2666 Mbps with a JEDEC standard supply voltage of 1.2 V. The device features an internal structure of eight banks arranged in two bank groups. It supports commercial operating case temperatures ranging from 0°C to +95°C, requiring doubled refresh cycles above 85°C.

Memory IC Feature Summary

• Supports double-data-rate architecture with 8-bit prefetch pipelined interface for high-speed data transfer.
• Features differential clock inputs and edge-aligned data strobes for precise signal capturing.
• Includes dynamic on-die termination and programmable burst lengths for flexible system integration.
• Provides command and address parity checking alongside write cycle redundancy code support.

Memory IC Applications

• High-performance computing systems
• Server memory modules
• Enterprise storage arrays

Memory IC Procurement Notes

Verify the specific speed bin and die revision against current manufacturing requirements before procurement. Confirm that the 96-ball FBGA package dimensions align with the target PCB layout. Ensure the design supports the required 1.2V power supply specifications and thermal management for the commercial temperature range.

Memory IC Selection Notes

Select this component for applications requiring 16-bit wide memory interfaces with DDR4-2666 performance. Consider the 96-ball FBGA form factor for space-constrained designs. Evaluate the need for command/address parity and CRC features for system reliability requirements.

Memory IC Part Context

This part belongs to the Kingston DDR4 SDRAM family designed for general-purpose high-density memory applications. It adheres to JEDEC standards for DDR4 devices, ensuring compatibility with standard memory controllers supporting the specified speed grades and electrical characteristics.

Memory IC Replacement Considerations

Substitute parts must match the 256M x 16 organization, 96-ball FBGA package, and DDR4-2666 speed grade. Verify pinout compatibility and electrical parameters such as supply voltage and timing constraints.