DA4X101K0R

Diode Arrays Overview

The DA4X101K0R is a small signal switching diode manufactured by Panasonic Industry. It features an 80 V peak reverse voltage and a 100 mA forward current rating. The device exhibits a fast recovery time of 3 ns with a reverse leakage current of 100 nA. It operates within a temperature range of -55°C to +150°C. The component is housed in a Mini4-G4-B surface mount package, measuring approximately 2.9x2.8mm.

Diode Arrays Feature Summary

• High-speed switching capability with 3 ns recovery time
• Wide operating temperature range up to +150°C
• Compact Mini4-G4-B surface mount packaging

Diode Arrays Applications

• General purpose switching circuits
• High-frequency signal processing
• Automotive electronics applications

Diode Arrays Procurement Notes

Verify the End-of-Life (EOL) status before procurement, as the component is listed as discontinued. Confirm availability through authorized distributors or secondary market suppliers. Ensure compliance with RoHS requirements and check for Product Change Notifications (PCN) regarding manufacturing updates. Validate that the Mini4-G4-B package dimensions match the design footprint.

Diode Arrays Selection Notes

Select this component for designs requiring high-speed switching in compact spaces. The 80V rating suits low-voltage logic interfaces. Consider the +150°C maximum junction temperature for thermal management in dense assemblies. Verify compatibility with SMD/SMT assembly processes given the specific package type.

Diode Arrays Part Context

This part belongs to Panasonic's small signal diode portfolio, specifically designed for general-purpose switching applications. It utilizes glass passivation technology for stability. The Mini4-G4-B package allows for automated surface mount placement, supporting high-volume manufacturing efficiency in consumer and industrial electronics.

Diode Arrays Replacement Considerations

Consult official datasheets for pin-compatible alternatives from Panasonic or other manufacturers. Verify electrical parameters such as reverse voltage, forward current, and recovery time match or exceed original specifications. Check package dimensions to ensure mechanical fit without PCB redesign.