SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The DABP080806GE is a terminal box manufactured by nVent Hoffman, constructed from ABS and Polycarbonate materials. It provides IP66 and IP67 ingress protection ratings. The physical dimensions are 80 mm x 82 mm x 56 mm. The unit includes a grey cover.
Verify the manufacturer designation as nVent Hoffman or Hoffman Enclosures Inc. when sourcing. Confirm the specific material composition of ABS and Polycarbonate matches project requirements. Ensure the IP66 and IP67 ratings are suitable for the intended environmental conditions. Check that the grey cover is included with the order.
Select this model where compact terminal boxes with robust ingress protection are needed. The ABS and Polycarbonate construction offers resistance to various environmental factors. The IP66 and IP67 ratings ensure protection against dust and water jets or immersion. Consider the 80 mm x 82 mm x 56 mm size for space-constrained installations.
This component belongs to the DABP Series of terminal boxes from nVent Hoffman. These boxes are designed for electrical connections in demanding environments. The series emphasizes durability and protection through its material selection and sealing capabilities.
-768x745.jpg)
CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
Read More
Understand tactile switches, PCB and keyboard differences, four-pin wiring, debounce, force, travel and replacement checks for reliable control inputs.
Read More
In embedded design, the tug-of-war between cost and performance is constant. On one side, you have Microcontrollers (MCUs)—cheap, simple, and efficient. On the other,…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read More
STMicroelectronics (ST), a global leader in semiconductor manufacturing, has officially notified customers of a new round of price increases for selected products, set to…
Read More
What Is NAND Flash? A Practical Guide for Engineers & Procurement Teams In today’s data-driven world—from smartphones and SSDs to industrial IoT devices—NAND flash…
Read More
Understand voltage controlled oscillator tuning, phase noise and PLL operation. Check supply noise, output loading and requirements before selection.
Read MoreA digital-to-analog converter (DAC) turns a digital number into an analog voltage or current. It lets a controller set a physical output, such as…
Read More
Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
Read More
Hsinchu, Taiwan – April 18, 2026 – United Microelectronics Corporation (UMC, NYSE: UMC), a leading global semiconductor foundry specializing in mature process technologies, has…
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read MoreMay 4, 2026 — The global power semiconductor market is grappling with a worsening supply crunch, as lead times for key components have extended…
Read More