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DAC122S085CISD is listed in the Digital To Analog Converters range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC DAC 12BIT V-OUT 10WSON. Review the specifications below when checking this part for your BOM.
The DAC122S085CISD is a dual-channel, 12-bit digital-to-analog converter manufactured by Texas Instruments. It operates within an analog and digital supply voltage range of 2.7 V to 5.5 V. The device features a sampling rate of 2.5 MS/s and achieves a settling time of 6 µs. It utilizes a WSON-10 package for surface mount installation. Key performance metrics include a differential nonlinearity (DNL) of 0.2 LSB and an integral nonlinearity (INL) of +/- 2.4 LSB. The gain error is specified at 1% FSR, with a typical power consumption of 600 µW. It supports multiple serial interfaces including SPI, Microwire, and QSPI.
Verify the complete part number suffix against official Texas Instruments documentation to ensure correct package type and temperature rating. Confirm RoHS compliance status through current manufacturer datasheets. Cross-reference the specific ordering code with authorized distributors to validate availability and authenticity before procurement.
Select this component when dual-channel 12-bit resolution is required alongside low power constraints. Ensure the system voltage aligns with the 2.7 V to 5.5 V operating range. Verify that the WSON-10 footprint fits the PCB layout constraints. Compare DNL and INL specifications against application accuracy requirements.
This device belongs to the DAC122S085 series of micro-power digital-to-analog converters. It shares core architectural similarities with other members like the DAC124S085 but differs in channel count. The series is designed for cost-sensitive, space-constrained applications requiring reliable analog output generation from digital inputs.
Direct functional substitutes within the same family include the DAC122S085CIMR or DAC122S085CISDT/NOPB, provided pinout and electrical characteristics match. Verify package compatibility and thermal performance when considering alternative suffixes.
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