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DAC7552IRGTRG4 is listed in the Digital To Analog Converters range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC DAC 12BIT V-OUT 16QFN. Review the specifications below when checking this part for your BOM.
The DAC7552IRGTRG4 is a dual-channel, 12-bit digital-to-analog converter manufactured by Texas Instruments. It features an ultralow glitch impulse specification and voltage output buffers. The device operates on a single analog and digital power supply ranging from 2.7 V to 5.5 V. It supports serial interfaces including SPI, Microwire, and QSPI. The component is housed in a 16-pin VQFN package with a 3x3 mm footprint. Key electrical parameters include a settling time of 5 µs, a gain error of 0.15% FSR, and a typical power consumption of 675 µW at 5 V.
Verify the specific suffix G4 indicates RoHS compliance and lead-free manufacturing status as per Texas Instruments standards. Confirm the IRGTR designation corresponds to the tape-and-reel packaging format suitable for automated surface-mount assembly processes. Ensure the operating temperature range meets the -40°C to +105°C requirements for industrial environments.
Select this component when dual-channel performance is required alongside strict glitch impulse limitations. Compare against the DAC7553 if additional serial data out (SDO) functionality is necessary for daisy-chaining applications. Consider the DAC7551 for single-channel designs or the DAC7554 for quad-channel configurations within the same family.
This part belongs to the DAC755x series of 12-bit voltage-output digital-to-analog converters. It shares architectural similarities with the DAC7551, DAC7553, and DAC7554, differing primarily in channel count and specific interface features. The device utilizes a resistor-string architecture to achieve its specified resolution and linearity characteristics.
The DAC7552IRGTT is a pin-compatible alternative offered by Texas Instruments. Verify that the tape-and-reel versus cut-tape packaging differences do not impact existing assembly equipment capabilities before substitution.
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