DAN202FMT106

Diode Arrays Overview

The DAN202FMT106 is a small signal switching diode manufactured by ROHM Semiconductor, housed in an SOT-323 (UMD3) surface-mount package. It features a dual common cathode configuration with a peak reverse voltage of 80 V and a maximum forward current of 300 mA. Key electrical parameters include a fast recovery time of 4 ns, a forward voltage of 1.2 V at 100 mA, and a low reverse current of 100 nA. The device supports a maximum operating junction temperature of +150 °C and is designed for high-speed switching applications.

Diode Arrays Feature Summary

• High-speed switching capability with a 4 ns reverse recovery time
• Automotive-grade reliability compliant with AEC-Q101 standards
• Compact surface-mount design suitable for space-constrained modules

Diode Arrays Applications

• High-speed switching circuits in automotive electronic control units
• Signal processing within compact modular assemblies
• General-purpose rectification in consumer electronics

Diode Arrays Procurement Notes

Verify the specific ordering suffix to confirm packaging details such as tape-and-reel quantities. Ensure the component meets the required AEC-Q101 qualification if used in automotive contexts. Cross-reference the datasheet for thermal management requirements under maximum load conditions. Confirm RoHS compliance status through official manufacturer documentation before integration into final products.

Diode Arrays Selection Notes

Select this component when a dual common cathode configuration is required in a minimal footprint. The 80 V rating suits low-voltage signal paths, while the 4 ns recovery time addresses high-frequency switching needs. Consider the SOT-323 package constraints for PCB layout and thermal dissipation capabilities relative to the 200 mW power dissipation limit.

Diode Arrays Part Context

This part belongs to ROHM's DAN series of small signal switching diodes, which are engineered for high reliability in automotive and industrial environments. The series emphasizes miniaturization through mold-type packages like UMD3, enabling dense circuit board layouts without compromising electrical performance or thermal stability.

Diode Arrays Replacement Considerations

The DAP202FMFH is listed as a similar specification alternative within the same family. Verify pinout compatibility and exact parameter tolerances before substitution.