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DD260N18KKHPSA1 is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is DIODE MOD GP 1800V 260A MOD. Review the specifications below when checking this part for your BOM.
Diode Arrays specifications for DD260N18KKHPSA1
- Description：DIODE MOD GP 1800V 260A MOD
- Series：-
- Mfr：Infineon Technologies
- Package：Bulk
- Diode Configuration：1 Pair Series Connection
- Technology：Standard
- Voltage - DC Reverse (Vr) (Max)：1800 V
- Current - Average Rectified (Io) (per Diode)：260A
- Voltage - Forward (Vf) (Max) @ If：1.32 V @ 800 A
- Speed：Standard Recovery >500ns, > 200mA (Io)
- Reverse Recovery Time (trr)：-
- Current - Reverse Leakage @ Vr：30 mA @ 1800 V
- Operating Temperature - Junction：150°C
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：Module
- Grade：-
- Qualification：-
Diode Arrays datasheet and documents for DD260N18KKHPSA1
Diode Arrays Overview
The DD260N18KKHPSA1 is a silicon diode array module manufactured by Infineon Technologies. It features a dual-arm configuration with one pair in series connection, designed for chassis mounting. The device is rated for a repetitive peak reverse voltage of 1800 V and an average forward current of 260 A. This component utilizes press-pack contact technology to ensure high reliability and efficient thermal management within power electronic systems.
Diode Arrays Feature Summary
- Dual-arm diode array configuration with series-connected pairs
- High-voltage rating of 1800 V repetitive peak reverse voltage
- Robust 260 A average forward current capability
- Chassis mount design utilizing press-pack contact technology
Diode Arrays Applications
- Industrial power conversion systems
- High-voltage DC transmission applications
- Heavy-duty rectifier circuits
Diode Arrays Procurement Notes
Verify the specific datasheet version and technical specifications directly from Infineon Technologies before integration. Confirm that the chassis mounting requirements and thermal interface materials align with the system design constraints. Ensure compliance with relevant industrial standards for high-power semiconductor modules during procurement and installation processes.
Diode Arrays Selection Notes
Select this module for applications requiring high voltage isolation and substantial current handling capacity. The press-pack construction offers advantages in thermal performance and mechanical stability compared to traditional leaded packages. Evaluate the system's cooling infrastructure to accommodate the module's power dissipation characteristics effectively.
Diode Arrays Part Context
This component belongs to the DD260N series of diode arrays from Infineon Technologies. It is part of the discrete and power modules category, specifically designed for demanding power electronics environments. The series emphasizes robustness and high-performance rectification capabilities for industrial-grade equipment.
Diode Arrays Replacement Considerations
Public confirmed substitute part numbers are not available in the provided documentation. Consult official Infineon resources for potential cross-references or updated product line replacements.
Explore related parts through Rectifiers, Diodes, Discrete Semiconductor Products, all product categories.
