DD350N12KHPSA1

Diode Arrays Overview

The DD350N12KHPSA1 is a silicon rectifier diode module manufactured by Infineon Technologies. It features a single-phase, two-element configuration housed in a MODULE-3 package. The device supports a maximum repetitive peak reverse voltage of 1200 V and an average on-state current of 350 A. It is designed for high-power applications with a maximum non-repetitive peak forward current of 11,000 A and a surge current limit integral (I²t-value) capability. The module operates at junction temperatures up to 150 °C.

Diode Arrays Feature Summary

• Utilizes pressure contact technology for reliable thermal and electrical connections.
• Designed as a robust power semiconductor module for high-current industrial environments.
• Features a standard recovery characteristic suitable for general rectification tasks.

Diode Arrays Applications

• Industrial motor drives
• Welding equipment
• Uninterruptible power supplies

Diode Arrays Procurement Notes

Verify the specific suffix K against official datasheets to confirm mechanical dimensions and terminal configurations. Ensure compatibility with existing cooling systems given the 350 A current rating. Confirm RoHS compliance status through manufacturer documentation prior to integration into regulated assemblies.

Diode Arrays Selection Notes

Select this module when high current capacity and 1200 V blocking voltage are required in a compact form factor. Consider the MODULE-3 footprint for PCB or chassis mounting constraints. Evaluate thermal management requirements based on the 150 °C maximum junction temperature specification.

Diode Arrays Part Context

This component belongs to Infineon's high-power diode module portfolio, specifically designed for demanding power conversion applications. It complements other modules in the series offering varying current ratings and voltage levels for scalable power system designs.

Diode Arrays Replacement Considerations

Consult official replacement guides for direct substitutes. Verify pinout and thermal interface compatibility before swapping with alternative part numbers from different manufacturers.