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DG271BCJ is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists Vishay Siliconix. Its product description is IC SWITCH SPST-NCX4 50OHM 16DIP. Review the specifications below when checking this part for your BOM.
The DG271BCJ-E3 is a high-speed quad monolithic SPST CMOS analog switch manufactured by Vishay Siliconix. It features a low on-resistance of 32 Ω and fast switching times with turn-on at 55 ns and turn-off at 50 ns. The device operates on dual supplies ranging from ±4 V to ±20 V, supporting an analog signal range up to ±15 V. It exhibits low charge injection of 5 pC and minimal leakage currents. Packaged in a 16-pin plastic DIP, it functions within a commercial temperature range of 0 °C to 70 °C.
Verify the exact ordering suffix against current manufacturer documentation. The CJ suffix indicates a 16-pin Plastic DIP package suitable for through-hole mounting. Confirm that the -E3 designation aligns with lead-free RoHS compliance requirements for your specific manufacturing process. Ensure the component meets the required commercial temperature range specifications.
Select this component when designing circuits requiring fast settling times and high precision analog switching. The low on-resistance makes it suitable for applications demanding minimal signal attenuation. Verify that the supply voltage range matches the system's power rails. Consider the 16-pin DIP package constraints regarding PCB layout and available board space during the initial design phase.
This part belongs to the DG271B series of high-speed analog switches. It utilizes a proprietary high-voltage silicon gate process to achieve superior on/off performance. The internal redesign improves start-up characteristics compared to earlier iterations. The device includes an epitaxial layer to prevent latchup, enhancing reliability in various operating conditions.
Direct pin-to-pin replacements include the DG271BDY-E3 (Narrow SOIC) or DG271BDY-T1-E3 (Reel). Verify package dimensions and thermal dissipation ratings when transitioning between DIP and SOIC formats.
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