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DG526CY
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Product Detailed Parameters
- Description：IC MUX 16:1 450OHM 28SOIC
- Series：-
- Mfr：Harris Corporation
- Package：Bulk
- Switch Circuit：-
- Multiplexer/Demultiplexer Circuit：16:01
- On-State Resistance (Max)：450Ohm
- Channel-to-Channel Matching (ΔRon)：27Ohm
- Voltage - Supply, Single (V+)：44V
- Voltage - Supply, Dual (V±)：±22V
- Switch Time (Ton, Toff) (Max)：700ns (Typ), 400ns (Typ)
- -3db Bandwidth：-
- Charge Injection：6pC
- Channel Capacitance (CS(off), CD(off))：10pF, 65pF
- Current - Leakage (IS(off)) (Max)：5nA
- Crosstalk：-
- Operating Temperature：0°C ~ 70°C
- Mounting Type：Surface Mount
- Package / Case：28-SOIC (0.295", 7.50mm Width)
- Supplier Device Package：28-SOIC
- Number of Circuits：1
- Grade：-
- Qualification：-
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Overview
The DG526CY is a single-ended multiplexer manufactured by Harris Corporation, featuring 16 selectable channels. It utilizes CMOS technology and is housed in a CDIP-28 ceramic dual in-line package. The device operates as a single-function analog switch, allowing one of sixteen input lines to be connected to a common output based on digital address inputs. This component is designed for applications requiring reliable signal routing in electronic systems.
Feature Summary
- CMOS construction for low power consumption
- 16-channel single-ended multiplexing capability
- Ceramic dual in-line packaging for durability
Applications
- Data acquisition systems
- Industrial process control
- Communication equipment
Part Context
The DG526CY belongs to the DG526 series of analog multiplexers originally developed by Harris Semiconductor. This family of components was widely used before Harris's semiconductor division became part of Intersil and subsequently Renesas Electronics. The 'C' suffix typically denotes the ceramic DIP package variant, distinguishing it from plastic or other package options within the same functional family.
Replacement Considerations
Equivalent parts include the DG526CK and DG526CN from various manufacturers such as Intersil, Vishay, and Rochester Electronics. Verify pin compatibility and package dimensions when substituting.
