SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The DMP1220E is a galvanized steel mounting plate manufactured by Hoffman Enclosures, Inc. It measures 4.7 inches in height, 7.9 inches in width, and 4.1 inches in depth (120mm x 200mm x 105mm). The component features a perforated surface design for versatile hardware installation. It serves as an IEC back plate or general mounting accessory for electrical enclosures.
Verify the specific dimensional requirements against the 4.7-inch height and 7.9-inch width specifications before ordering. Confirm that the galvanized steel material and perforated design align with the intended environmental conditions and mounting hardware needs for the enclosure assembly.
Select this component when a durable, corrosion-resistant steel mounting solution is required for standard IEC-compatible applications. The perforated design offers greater flexibility compared to solid plates, allowing for varied screw positions. Ensure the 120x200mm footprint fits within the target enclosure's internal dimensions.
This part belongs to the Hoffman Enclosures line of box and rack accessories. It functions as a generic mounting plate rather than a specialized connector or sensor. The product is categorized under enclosure general accessories, providing structural support rather than active electronic functionality.
Public confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing enclosure frames if considering alternative manufacturers.
TOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read MoreThe Dutch government’s intervention in the control of Nexperia (Anshi Semiconductor) is triggering a chain reaction of turmoil in the global power semiconductor market.…
Read More
Tempe, Arizona‑based semiconductor giant Microchip Technology has formally rolled out selective product price increases across its MCU, power‑management IC, memory controller and analog component…
Read More
Recently, the global electronic component market has witnessed complex and changeable trends. In the memory chip sector, the wave of price increases continues to…
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read More
What Is NOR Flash? Why It Still Powers Critical Embedded Systems When your car’s engine control unit boots in milliseconds…When a medical device executes…
Read More
[Shenzhen/Shanghai/Beijing, January 2025] — As global digital transformation accelerates, the electronic components industry has reached a critical inflection point in 2025. Emerging fields such…
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
Compare Pt100 and Pt1000 RTDs, two-, three- and four-wire connections, excitation and self-heating. Build an error budget from element to reported temperature.
Read MoreSANTA CLARA, Calif. — Leading semiconductor solution provider Marvell Technology (NASDAQ: MRVL) officially rolled out a selective price adjustment for its core electronic component…
Read More
Choose LED drivers by current, string voltage, dimming and thermal limits. Understand constant-current operation and the checks needed for your load.
Read More