DSEC29-06AC

Diode Arrays Overview

The DSEC29-06AC is a HiPerFRED epitaxial diode from IXYS, housed in an ISOPLUS220 package. It features a 600V repetitive peak reverse voltage and a 15A average forward current rating per element. The device utilizes a common cathode configuration with two silicon elements. Key electrical characteristics include a maximum forward voltage of 1.49V and a reverse recovery time of 35ns. It supports a non-repetitive peak forward surge current of 110A and operates within a junction temperature range of -55°C to +175°C.

Diode Arrays Feature Summary

• Epitaxial diode technology for high-speed switching performance
• Electrically isolated back surface design for simplified mounting
• Soft recovery characteristic suitable for snubber and free-wheeling applications

Diode Arrays Applications

• Snubber diode circuits
• Free-wheeling diode configurations
• Soft recovery applications

Diode Arrays Procurement Notes

Verify the specific suffix against official datasheets to confirm pinout and isolation type. Ensure thermal management aligns with the ISOPLUS220 package requirements. Confirm RoHS compliance status through manufacturer documentation prior to integration into production designs.

Diode Arrays Selection Notes

Select this component for applications requiring fast recovery times and electrical isolation. The 600V rating suits medium-voltage power conversion systems. Evaluate thermal dissipation needs based on the 15A per element current capability and the specific operating environment constraints.

Diode Arrays Part Context

This part belongs to the HiPerFRED series by IXYS, designed for high-efficiency power electronics. The ISOPLUS220 package provides a robust mechanical solution with an electrically isolated backside, facilitating direct heatsink attachment without additional insulators.

Diode Arrays Replacement Considerations

Cross-reference with other HiPerFRED variants in the same voltage and current class. Verify that substitute parts maintain the 35ns reverse recovery time and compatible package dimensions for board compatibility.