Memory IC EDB4432BBBJ-1D-F-D product image

EDB4432BBBJ-1D-F-D

  • Description:IC DRAM 4GBIT PARALLEL 134FBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Bulk

SKU:2ee16b8d1e71 Category: Brand:

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EDB4432BBBJ-1D-F-D is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 4GBIT PARALLEL 134FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for EDB4432BBBJ-1D-F-D

  • Description:IC DRAM 4GBIT PARALLEL 134FBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Bulk
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile LPDDR2
  • Memory Size:4Gbit
  • Memory Organization:128M x 32
  • Memory Interface:Parallel
  • Clock Frequency:533 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.14V ~ 1.95V
  • Operating Temperature:-30°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:134-WFBGA
  • Supplier Device Package:134-FBGA (10x11.5)
  • Access Time:-

Memory IC datasheet and documents for EDB4432BBBJ-1D-F-D

EDB4432BBBJ-1D-F-D

Memory IC Overview

The EDB4432BBBJ-1D-F-D is a Micron LPDDR2 SDRAM component designed for mobile applications. It features a 4 Gbit storage capacity organized as 128 M x 32 bits with a 32-bit data bus width. The device supports a maximum clock frequency of 533 MHz and has an access time of 5.5 ns. It operates within a voltage range of 1.14 V to 1.95 V and functions in temperatures from -40°C to +105°C. The memory is housed in a WFBGA-134 package.

Memory IC Feature Summary

  • LPDDR2 architecture optimized for low power consumption in mobile devices
  • High-density 4 Gbit storage with wide 32-bit data interface
  • Industrial temperature rating for extended operational reliability

Memory IC Applications

  • Smartphones and tablets requiring high-bandwidth mobile memory
  • Portable consumer electronics with space constraints
  • Embedded systems operating in industrial environments

Memory IC Procurement Notes

Verify the specific suffix '1D' against official Micron documentation to confirm speed grade and pin configuration compatibility. Confirm RoHS compliance status through current datasheets. Check lifecycle status directly with the manufacturer, as availability may vary by region and production phase.

Memory IC Selection Notes

Select this part when a 4 Gbit density and 32-bit bus width are required for LPDDR2 designs. Ensure the system supports the specified 1.14 V to 1.95 V voltage range. Verify that the PCB layout accommodates the WFBGA-134 package dimensions and thermal requirements for the -40°C to +105°C operating range.

Memory IC Part Context

This component belongs to the Micron EDB series of mobile DRAMs. It utilizes LPDDR2 technology to balance performance and power efficiency. The 134-ball form factor allows for compact integration into portable electronic devices where board space is limited but memory bandwidth demands are significant.

Memory IC Replacement Considerations

Consult Micron's official cross-reference tools for verified substitutes. Consider newer LPDDR3 or LPDDR4 variants if backward compatibility is not required. Verify pin-to-pin compatibility before replacing existing inventory.

EDB4432BBBJ-1D-F-DEDB4432BBBJ-1D-F-D

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