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EL2141CSZ is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC OPAMP DIFF 1 CIRCUIT 8SOIC. Review the specifications below when checking this part for your BOM.
The EL2141CSZ is a high-bandwidth differential twisted pair driver manufactured by Renesas Electronics Corporation (formerly Intersil). It features fully differential inputs, outputs, and feedback with a 150MHz -3dB bandwidth. The device operates on ±5V supplies or +6V single supply, providing an 800 V/µs slew rate and 50mA minimum output current. It includes a reference pin for output common-mode control and short-circuit protection.
Verify the manufacturer origin as the component was originally produced by Intersil before its acquisition by Renesas. Confirm that the 'S' suffix denotes the 8-pin SOIC package and the 'Z' indicates lead-free compliance. Ensure the operating temperature range matches the specified -40°C to +85°C for your application environment.
Select the EL2141CSZ when adjustable gain is required, as opposed to the fixed-gain EL2140. Consider the 150MHz bandwidth and low distortion characteristics for high-frequency signal integrity. Evaluate power supply requirements against the ±5V or +6V single supply options. Account for layout constraints regarding stray capacitance on feedback nodes to prevent gain peaking.
This component belongs to the EL2140/EL2141 family of differential amplifiers designed for driving twisted pair lines. It utilizes advanced analog design techniques to achieve high bandwidth and low distortion. The EL2141 variant specifically provides user-configurable gain through dedicated feedback pins, offering flexibility in circuit design compared to fixed-gain alternatives.
The EL2140 is a compatible alternative within the same family but features a fixed gain of two. Verify if the specific application requires adjustable gain; if not, the EL2140 may serve as a direct functional substitute. Ensure pin compatibility and thermal performance align with the existing design constraints.
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