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EL9214IREZ-T13 is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC OPAMP GP 4 CIRCUIT 14HTSSOP. Review the specifications below when checking this part for your BOM.
The EL9214IREZ-T13 is a high-speed, dual-channel analog switch manufactured by Renesas Electronics Corporation. It operates within a supply voltage range of 2.7V to 5.5V and supports bidirectional signal transmission with low on-resistance. The device features fast switching times and low charge injection, making it suitable for precision data acquisition and multiplexing applications. It is available in an 8-lead SOIC surface-mount package and is rated for operation over an industrial temperature range.
Verify the exact suffix T13 against official Renesas documentation to confirm tape-and-reel quantity specifications. Confirm RoHS compliance status and lead-free material declarations directly from the current datasheet revision. Ensure the operating temperature range meets specific environmental requirements before integration into final designs.
Select this component when dual-channel isolation with low distortion is required. Compare on-resistance flatness and leakage current specifications against alternative switches for critical accuracy needs. Evaluate package thermal performance and pin compatibility during PCB layout planning to ensure seamless replacement or upgrade paths.
This part belongs to the EL9214 series of high-performance analog switches. It complements Renesas' portfolio of signal chain components designed for robust industrial and commercial applications. The series emphasizes reliability and signal fidelity, aligning with broader system requirements for noise reduction and precise control in complex electronic architectures.
Consult official cross-reference tools for parametrically equivalent parts. Verify pinout compatibility and electrical specifications such as on-resistance and breakdown voltage before substituting. Ensure any alternative maintains the same package dimensions and thermal characteristics for direct board-level replacement.
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