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EZR32WG230F256R63G-C0R is listed in the RF Transceiver ICS range at ChipApex. The manufacturer field lists Silicon Labs. Its product description is IC RF TXRX+MCU 802.15.4 64QFN. Review the specifications below when checking this part for your BOM.
The EZR32WG230F256R63G-C0R is a Sub-GHz Wireless Gecko System-on-Chip integrating an ARM Cortex-M4 processor with an EZRadioPro transceiver. It features 256 kB of flash memory and 32 kB of RAM, operating at a maximum clock frequency of 48 MHz. The device supports frequencies from 142 MHz to 1.05 GHz with a data rate of 1 Mbps. It includes a 12-bit ADC, two SPI channels, two I2C interfaces, and two UART/USART ports. Operating voltage ranges from 1.98 V to 3.8 V within a temperature range of -40 °C to +85 °C.
Verify the specific suffix 'C0R' against official Silicon Labs documentation to confirm tape-and-reel packaging and environmental compliance status. Ensure the selected variant matches the required operating temperature range and pin configuration for the target PCB design. Cross-reference the datasheet revision to validate all electrical characteristics prior to final procurement decisions.
Select this component when a balance of processing power and long-range Sub-GHz communication is required. The Cortex-M4 core handles complex protocol stacks while the integrated radio reduces external BOM. Consider the 64-pin QFN package constraints and thermal dissipation requirements during layout. Verify that the 256 kB memory size accommodates the application firmware and network stack overhead.
This part belongs to the EZR32WG family of wireless MCUs from Silicon Labs. These devices are designed for energy-efficient IoT applications requiring reliable Sub-GHz transmission. The family offers various memory and package options to suit different form factors and performance needs while maintaining compatibility with Silicon Labs development tools and software libraries.
Consult the official Silicon Labs cross-reference guide for verified substitutes. Alternative parts may differ in memory size, package dimensions, or RF performance specifications. Ensure any replacement maintains compatibility with existing firmware and hardware designs.
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