FEP16FT

Diode Arrays Overview

The FEP16FT is a glass-passivated fast rectifier diode manufactured by onsemi (formerly Fairchild). It features a maximum repetitive reverse voltage of 300 V and an average rectified forward current of 16 A. The device exhibits a low forward voltage drop of 1.5 V at 8.0 A and a reverse recovery time of 50 ns. It supports a non-repetitive peak forward surge current of 200 A and operates within a junction temperature range of -55°C to +150°C.

Diode Arrays Feature Summary

• Glass passivation for high reliability
• Low forward voltage drop
• High surge current capacity

Diode Arrays Applications

• General purpose rectification
• Fast switching power supplies
• DC-DC converters

Diode Arrays Procurement Notes

Verify the specific suffix 'FT' against the manufacturer's current ordering guide, as legacy Fairchild part numbers may have been reclassified or renamed under ON Semiconductor systems. Confirm package details and lead availability through authorized distributors. Ensure compliance with RoHS requirements if applicable to the specific production lot.

Diode Arrays Selection Notes

Select this component for applications requiring 300 V blocking capability and 16 A continuous current handling. The 50 ns reverse recovery time makes it suitable for higher frequency switching compared to standard rectifiers. Consider thermal resistance values when designing heatsinking solutions for high ambient temperatures.

Diode Arrays Part Context

This device belongs to the FEP16AT-FEP16JT series of fast rectifiers. The series offers various voltage ratings from 50 V to 600 V while maintaining consistent current and recovery characteristics. Originally produced by Fairchild Semiconductor, these parts are now managed by ON Semiconductor following corporate integration.

Diode Arrays Replacement Considerations

Direct substitutes include other 300V, 16A ultrafast rectifiers in TO-220AB packages. Verify equivalent reverse recovery times and forward voltage drops. Check for pinout compatibility and thermal performance similarities before implementation.