FFA30U60DNTU

Diode Arrays Overview

The FFA30U60DNTU is a dual common cathode ultrafast recovery power rectifier manufactured by onsemi. It features a peak repetitive reverse voltage of 600 V and an average forward current rating of 30 A at a case temperature of 100°C. The device exhibits a maximum instantaneous forward voltage of 2.3 V at 30 A and 25°C, with a non-repetitive peak surge current capability of 180 A. Key electrical parameters include a maximum reverse recovery time of 90 ns, a maximum reverse recovery charge of 360 nC, and a junction-to-case thermal resistance of 0.8 °C/W. It operates within a temperature range of -65 to +150°C.

Diode Arrays Feature Summary

• Ultrafast recovery characteristics for high-speed switching applications
• Rugged avalanche energy rated capability
• Low forward voltage drop for improved efficiency
• Dual common cathode configuration in a single package

Diode Arrays Applications

• Switching mode power supplies
• Free-wheeling diodes for motor applications
• General purpose power switching circuits

Diode Arrays Procurement Notes

Verify the specific ordering suffix against official documentation to confirm package type and compliance status. Confirm availability as this component may be subject to discontinuation or limited supply conditions depending on the manufacturing lifecycle stage. Ensure the selected variant matches the required thermal and electrical specifications for the target application environment.

Diode Arrays Selection Notes

Select this component for designs requiring high-voltage handling and fast reverse recovery times. Evaluate the thermal management requirements based on the specified junction-to-case thermal resistance. Consider the forward voltage characteristics at expected operating currents to ensure system efficiency targets are met. Verify that the peak surge current ratings align with potential inrush conditions in the circuit design.

Diode Arrays Part Context

This device belongs to the ultrafast recovery rectifier category, designed for robust performance in power conversion systems. Originally developed by Fairchild Semiconductor, the product line was integrated into onsemi's portfolio. The TO-3PN package provides a heatsink-compatible form factor suitable for through-hole mounting in industrial and commercial power electronics.

Diode Arrays Replacement Considerations

Consult official cross-reference guides for verified substitutes. Equivalent components must match the 600V voltage rating, 30A current capacity, and ultrafast recovery specifications.