Diode Arrays FFAF60A150DSTU product image

FFAF60A150DSTU

$0.78
  • Description:DIODE ARRAY TO3PF
  • Series:-

SKU:fbbbf05debe8 Category: Brand:

  
  • Quantity
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FFAF60A150DSTU is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Fairchild Semiconductor. Its product description is DIODE ARRAY TO3PF. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for FFAF60A150DSTU

  • Description:DIODE ARRAY TO3PF
  • Series:-
  • Mfr:Fairchild Semiconductor
  • Package:Tube
  • Diode Configuration:-
  • Technology:-
  • Voltage - DC Reverse (Vr) (Max):-
  • Current - Average Rectified (Io) (per Diode):-
  • Voltage - Forward (Vf) (Max) @ If:-
  • Speed:-
  • Reverse Recovery Time (trr):-
  • Current - Reverse Leakage @ Vr:-
  • Operating Temperature - Junction:-
  • Mounting Type:Through Hole
  • Package / Case:TO-3P-3 Full Pack
  • Supplier Device Package:TO-3PF
  • Grade:-
  • Qualification:-

Diode Arrays datasheet and documents for FFAF60A150DSTU

FFAF60A150DSTU

Diode Arrays Overview

The FFAF60A150DSTU is a dual common cathode ultra-fast recovery rectifier manufactured by Fairchild Semiconductor. It features a peak repetitive reverse voltage of 600V and an average forward current rating of 20A per diode. The device utilizes a TO-3P-3 Full Pack (TO-3PF) surface-mount package for robust thermal management. Key electrical specifications include a maximum forward voltage of 2.2V at rated current, a reverse leakage current of 100uA, and a fast recovery time of 90ns. The component supports a maximum surge current of 180A and operates within a junction temperature range of -65°C to +150°C.

Diode Arrays Feature Summary

  • Ultra-fast recovery characteristics with 90ns switching speed for high-frequency applications
  • Dual common cathode configuration providing two independent rectifying paths in one package
  • High thermal performance enabled by the TO-3P-3 Full Pack leaded surface-mount design

Diode Arrays Applications

  • Modulation circuits in power electronics systems
  • Damper diode implementations in motor drives
  • High-frequency DC-DC converter output rectification

Diode Arrays Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels due to obsolete status. Confirm RoHS compliance details via official documentation prior to integration. Ensure storage conditions maintain integrity given the end-of-life classification. Request batch-specific test reports if required for critical reliability standards. Validate pinout compatibility during PCB layout finalization.

Diode Arrays Selection Notes

Select this component when high-speed switching and moderate current handling are required in a single package. The dual common cathode topology simplifies circuit design compared to discrete solutions. Consider the TO-3P-3 footprint constraints and thermal pad requirements during mechanical assembly planning. Evaluate thermal resistance parameters against system heat dissipation capabilities.

Diode Arrays Part Context

This part belongs to the FFAF series of ultra-fast recovery rectifiers designed for demanding power conversion environments. The TO-3P-3 package variant offers improved solder joint reliability compared to traditional through-hole options while maintaining high current capacity. Fairchild Semiconductor developed this line to address efficiency losses in high-frequency switching applications.

Diode Arrays Replacement Considerations

Cross-reference with FFAF60A150DS for equivalent functional specifications. Verify pin-to-pin compatibility and thermal characteristics before substitution. Check datasheet updates for any parameter variations between manufacturing generations.

FFAF60A150DSTUFFAF60A150DSTU
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