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FFP04H60STU is listed in the Single Diodes range at ChipApex. The manufacturer field lists onsemi. Its product description is DIODE STANDARD 600V 4A TO2202L. Review the specifications below when checking this part for your BOM.
The FFP04H60STU is a hyperfast rectifier featuring silicon nitride passivation and ion-implanted epitaxial planar construction. It provides a peak repetitive reverse voltage of 600V and an average forward current rating of 4A at a case temperature of 135°C. The device exhibits a maximum reverse recovery time of 45ns at 4A, with a typical value of 21ns under specific test conditions. Forward voltage drop remains below 2.1V at 4A, while non-repetitive peak surge current reaches 40A. Thermal resistance from junction to case is specified at 2.55°C/W.
Verify the manufacturer origin as Fairchild Semiconductor or onsemi due to corporate acquisition history. Confirm the package marking matches 'F04H60S' for the TO-220-2L configuration. Ensure compliance with RoHS standards if required by the design specifications. Check for any specific handling precautions related to the hyperfast recovery properties during circuit integration.
Select this component for applications requiring fast recovery times to reduce switching losses and electromagnetic interference. The 600V rating suits general-purpose high-voltage rectification tasks. Consider the thermal management requirements given the 2.55°C/W junction-to-case resistance. Evaluate the 4A continuous current capability against the expected load profile and ambient operating temperatures.
This part belongs to the Hyperfast 2 rectifier series designed for efficient power conversion. It utilizes advanced planar technology to achieve superior performance compared to standard rectifiers. The TO-220-2L package facilitates effective heat dissipation for medium-power applications. The product line focuses on minimizing reverse recovery charge to enhance overall system efficiency.
Direct substitutes must match the 600V reverse voltage, 4A forward current, and TO-220-2L package dimensions. Verify that alternative components offer comparable reverse recovery times to maintain circuit stability. Ensure thermal resistance specifications are equivalent to prevent overheating in existing heatsink configurations.
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