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FSA1156P6 is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists onsemi. Its product description is IC SWITCH SPST-NOX1 900MOHM SC88. Review the specifications below when checking this part for your BOM.
The FSA1156P6X is a single-pole single-throw (SPST) analog switch manufactured by onsemi, designed for low-voltage applications. It operates within a supply voltage range of 1.65 V to 5.5 V and features a maximum on-resistance of 900 mOhms. The device supports a DC switch current of 200 mA with a maximum power dissipation of 180 mW. Electrical performance includes a maximum turn-on time of 20 ns and a maximum turn-off time of 30 ns. It functions reliably across an operating temperature range from -40°C to +85°C. The component is housed in a compact SC-70-6 surface-mount package.
Verify the specific suffix designation when sourcing, as the FSA1156P6X variant is listed with an obsolete status in available records. Confirm availability through authorized distributors or secondary markets, as standard factory production may have ceased. Ensure the SC-70-6 package matches the target PCB footprint requirements before finalizing procurement decisions.
Select this component for designs requiring minimal insertion loss in low-voltage analog paths. The 900 mOhm on-resistance suits applications where moderate signal attenuation is acceptable. Verify that the 200 mA current rating aligns with the load requirements. Consider the SC-70-6 package dimensions for space-constrained layouts compared to larger alternatives.
This part belongs to the FSA1156 series of analog switches from onsemi. The series focuses on low-power, high-performance switching solutions for portable devices. Variants such as the FSA1156L6X share similar electrical characteristics but utilize a MicroPak-6 package instead of the SC-70-6 form factor found in the P6X version.
The FSA1156L6X serves as a functional substitute with identical electrical specifications, differing only in the MicroPak-6 packaging. Designers must adjust the PCB land pattern if transitioning between the SC-70-6 and MicroPak-6 footprints.
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