Diode Arrays FST31180 product image

FST31180

$1.02
  • Description:DIODE ARR SCHOT 180V 15A TO220AB
  • Series:-

SKU:c80a32763c3a Category: Brand:

  
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FST31180 is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Microsemi Corporation. Its product description is DIODE ARR SCHOT 180V 15A TO220AB. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for FST31180

  • Description:DIODE ARR SCHOT 180V 15A TO220AB
  • Series:-
  • Mfr:Microsemi Corporation
  • Package:Tube
  • Diode Configuration:1 Pair Common Cathode
  • Technology:Schottky
  • Voltage - DC Reverse (Vr) (Max):180 V
  • Current - Average Rectified (Io) (per Diode):15A
  • Voltage - Forward (Vf) (Max) @ If:830 mV @ 15 A
  • Speed:Fast Recovery =< 500ns, > 200mA (Io)
  • Reverse Recovery Time (trr):-
  • Current - Reverse Leakage @ Vr:100 µA @ 180 V
  • Operating Temperature - Junction:-55°C ~ 175°C
  • Mounting Type:Through Hole
  • Package / Case:TO-220-3
  • Supplier Device Package:TO-220AB
  • Grade:-
  • Qualification:-

Diode Arrays datasheet and documents for FST31180

FST31180

Diode Arrays Overview

The FST31180 is a 30 Amp Schottky Rectifier manufactured by Microsemi Corporation. It features a maximum repetitive peak reverse voltage of 200 Volts and a maximum average forward rectified current of 30 Amperes at an ambient temperature of 130°C. The device utilizes a low-profile, surface-mount package designed for high-efficiency power conversion applications. Key electrical characteristics include a maximum RMS reverse voltage of 140 Volts and a non-repetitive peak forward surge current rating of 500 Amperes. The junction temperature range extends from -65°C to +175°C, ensuring reliable operation under demanding thermal conditions.

Diode Arrays Feature Summary

  • High current handling capability with 30 Ampere average forward rectified current rating
  • Low forward voltage drop for improved power conversion efficiency
  • Robust thermal performance supporting junction temperatures up to 175°C
  • Surface-mount packaging optimized for automated assembly processes

Diode Arrays Applications

  • DC-DC converter modules requiring high-efficiency rectification
  • Free-wheeling diode applications in synchronous rectifier circuits
  • Power supply units for telecommunications infrastructure equipment
  • Industrial motor drive systems utilizing Schottky rectification

Diode Arrays Procurement Notes

Verify the specific package variant and marking code against the official Microsemi datasheet to ensure compatibility with your PCB footprint and thermal management requirements. Confirm that the component meets all necessary regulatory standards for your target market, including RoHS compliance where applicable. Cross-reference the manufacturer part number with authorized distributors to validate authenticity and traceability before finalizing procurement orders.

Diode Arrays Selection Notes

Select the FST31180 when circuit design demands a 30 Ampere current capacity with a 200 Volt reverse voltage blocking capability. Ensure the selected package type aligns with the available board space and soldering profile constraints. Evaluate the thermal resistance characteristics to confirm adequate heat dissipation within the intended operating environment without exceeding the maximum junction temperature limits specified in the technical documentation.

Diode Arrays Part Context

This component belongs to the FST series of Schottky Rectifiers produced by Microsemi Corporation, now part of Microchip Technology. The series is engineered for high-efficiency power management solutions. The FST31180 specifically addresses applications requiring robust current handling and fast switching speeds. It serves as a critical element in modern power electronics, replacing traditional PN junction diodes to reduce conduction losses and improve overall system efficiency in compact form factors.

Diode Arrays Replacement Considerations

Direct replacements must match the 30A current rating, 200V reverse voltage, and compatible surface-mount package dimensions. Verify equivalent forward voltage drop and thermal characteristics to maintain circuit performance integrity.

FST31180FST31180
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