FST3384QSC

Overview

The onsemi FST3384QSC is a 10-bit low power bus switch housed in a 24-lead Quarter Size Outline Package (QSOP). It provides two independent 5-bit switches with separate enable signals. The device features a typical on-resistance of 4Ω and ultra-low quiescent supply current of 3µA at VCC=5.5V. Operating voltage ranges from 4.0V to 5.5V, with an operating temperature range of -40°C to +85°C.

Feature Summary

• Provides high-speed CMOS TTL-compatible bus switching with minimal propagation delay.
• Features ultra-low power consumption with negligible quiescent supply current.
• Ensures zero ground bounce noise during flow-through operation.

Applications

• High-speed data bus interconnects
• Portable electronic devices requiring low power dissipation
• System board signal routing

Procurement Notes

Verify the package designation MQA24 corresponds to the 24-lead QSOP form factor required for your PCB layout. Confirm that the ordering code matches the specific suffix needed for tape and reel availability if automated assembly is planned. Ensure the component meets the voltage and temperature specifications for your target environment before finalizing procurement.

Selection Notes

Select this component when designing systems requiring low insertion loss and minimal signal distortion across parallel data lines. The dual 5-bit configuration allows flexible partitioning of bus widths. Verify that the control logic levels are compatible with the TTL input requirements specified in the datasheet to ensure reliable switching operation.

Part Context

This part belongs to the FST3384 family of 10-bit bus switches originally developed by Fairchild Semiconductor. Following the integration into ON Semiconductor, product nomenclature may have been updated to remove underscores. The FST3384QSC specifically denotes the Quarter Size Outline Package variant within this series.

Replacement Considerations

Compatible variants include the FST3384WM (SOIC) and FST3384MTC (TSSOP), which share identical electrical characteristics but differ in physical package dimensions. Ensure mechanical fitment and pinout compatibility match the existing design constraints.