Logic Output Optoisolators HCPL-0201#060 product image

HCPL-0201#060

  • Description:OPTOISO 3.75KV PUSH PULL 8SOTALL
  • Series:-
  • Mfr:Broadcom Limited
  • Package:Tube

SKU:7217ff85e9fb Category: Brand:

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HCPL-0201#060 is listed in the Logic Output Optoisolators range at ChipApex. The manufacturer field lists Broadcom Limited. Its product description is OPTOISO 3.75KV PUSH PULL 8SOTALL. Review the specifications below when checking this part for your BOM.

Logic Output Optoisolators specifications for HCPL-0201#060

  • Description:OPTOISO 3.75KV PUSH PULL 8SOTALL
  • Series:-
  • Mfr:Broadcom Limited
  • Package:Tube
  • Number of Channels:1
  • Inputs - Side 1/Side 2:1/0
  • Voltage - Isolation:3750Vrms
  • Common Mode Transient Immunity (Min):1kV/µs
  • Input Type:DC
  • Output Type:Push-Pull, Totem Pole
  • Current - Output / Channel:25 mA
  • Data Rate:5MBd
  • Propagation Delay tpLH / tpHL (Max):300ns, 300ns
  • Rise / Fall Time (Typ):30ns, 7ns
  • Voltage - Forward (Vf) (Typ):1.5V
  • Current - DC Forward (If) (Max):10mA
  • Voltage - Supply:4.5V ~ 20V
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package:8-SO Tall
  • Grade:-
  • Qualification:-

Logic Output Optoisolators datasheet and documents for HCPL-0201#060

HCPL-0201#060

Logic Output Optoisolators Overview

The HCPL-0201#060 is a high-speed logic output optocoupler manufactured by Broadcom Limited. It features a single channel with an 8-SOIC surface-mount package. The device provides a data rate of 5 Mb/s and an isolation voltage of 3750 Vrms. Key electrical parameters include a typical rise time of 30 ns, fall time of 7 ns, and propagation delay of 150 ns. It operates within a temperature range of -40°C to +85°C and supports a forward current of up to 10 mA.

Logic Output Optoisolators Feature Summary

  • Integrates a GaAsP LED with a photodetector featuring a totem-pole output and built-in Schmitt trigger for direct logic-compatible waveform generation without external shaping circuits.
  • Provides robust signal isolation with a minimum common-mode transient immunity of 1 kV/µs and compliance with UL, CSA, and IEC safety standards.

Logic Output Optoisolators Applications

  • High-speed digital signal isolation in industrial control systems
  • Logic level translation between different voltage domains
  • Microprocessor system interface isolation
  • Elimination of ground loops in computer peripheral interfaces

Logic Output Optoisolators Procurement Notes

Verify component authenticity through authorized distributors due to the presence of legacy Avago branding. Confirm RoHS compliance status as some sources indicate non-compliance. Check lead times carefully as this part may be subject to limited availability or end-of-life restrictions. Ensure the SOIC-8 package variant matches the specific suffix requirements for your assembly process.

Logic Output Optoisolators Selection Notes

Select this component when high-speed digital isolation is required with integrated signal conditioning. The built-in Schmitt trigger eliminates the need for external resistors or capacitors for waveform shaping. Consider the 3750 Vrms isolation rating for applications requiring strong galvanic separation. Verify that the 5 Mb/s data rate meets the system's timing requirements before finalizing the design.

Logic Output Optoisolators Part Context

This device belongs to the HCPL-0201 series of high-speed optocouplers produced by Broadcom (formerly Avago). It is part of a family designed for fast logic switching applications. The #060 suffix specifically denotes the SOIC-8 surface-mount package configuration. This series is widely recognized for its reliability in noise-immune digital communication environments.

Logic Output Optoisolators Replacement Considerations

Direct substitutes include HCPL-0201#500 and HCPL-0201#560, which share identical electrical characteristics but differ in packaging. HCPL-0201-000E is another variant within the same functional family. Verify pinout compatibility and thermal performance when transitioning between DIP and SOIC packages.

HCPL-0201#060HCPL-0201#060

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