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HDL6V5582 is listed in the Specialized ICS range at ChipApex. The manufacturer field lists ABLIC Inc.. Its product description is IC ULTRASND DIG TRANS PULS. Review the specifications below when checking this part for your BOM.
The ABLIC HDL6V5582 is an eight-channel, high-voltage, high-speed fully-integrated pulser for medical ultrasound imaging applications. It supports two operational modes: an 8-channel 3-level pulser with active ground damping (MODE=1) and a 4-channel 5-level pulser with active ground damping (MODE=0). The device delivers ±100V output voltage and ±1.8A source/sink peak current for pulsing, along with ±0.5A for active ground damping. It operates up to 20MHz at ±60V output with a 220pF load and features a 1.8V to 5V CMOS logic interface.
Verify the specific ordering suffix against the manufacturer's datasheet to ensure correct package and temperature grade compatibility. Confirm that the 52-lead QFN package requirements align with the target PCB design, particularly regarding the exposed thermal pad soldering specifications.
Select MODE=1 for direct 8-channel control requiring two inputs per channel, or MODE=0 for 4-channel differential operation requiring three inputs per channel. Ensure the power supply sequence adheres to the recommended guidelines to prevent latch-up. Verify that the external decoupling capacitors meet the voltage ratings specified for high-voltage and low-voltage rails.
The HDL6V5582 belongs to ABLIC's ultrasound digital transmit pulser series. It utilizes SOI CMOS technology to achieve latch-up immunity and reduced crosstalk between channels. The component integrates logic interfaces, level translators, MOSFET gate drive buffers, and high-voltage/high-current MOSFETs into a single compact package.
The HDL6V5583 is a compatible alternative within the same product family offering similar octal high-voltage pulsing capabilities.
The device supports Mode 1 (8-channel 3-level pulser with active ground damping) and Mode 0 (4-channel 5-level pulser with active ground damping).
The device offers four-mode output drive current control via CC1 and CC0 pins to optimize power consumption based on the application requirements.
The IC includes thermal protection with a defined threshold and reset hysteresis, as well as latch-up immunity due to its SOI CMOS technology.
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