HFA100MD60D

Diode Arrays Overview

The HFA100MD60D is a HEXFRED ultrafast soft recovery diode module in an isolated TO-244AB package. It features two series-connected elements with a center tap, rated for 600V reverse voltage and 83A continuous forward current at 25°C case temperature. Key electrical parameters include a typical reverse recovery time of 33ns, peak recovery current of 8A, and reverse recovery charge of 300nC. The junction-to-case thermal resistance is 0.70°C/W per leg.

Diode Arrays Feature Summary

• Optimized for high-frequency power conditioning systems to reduce switching losses and electromagnetic interference.
• Soft recovery characteristics eliminate the need for snubber circuits in most applications.
• Extensive characterization of recovery behavior across varying current, temperature, and di/dt conditions simplifies loss calculations.

Diode Arrays Applications

• Power converters
• Motor drives
• High frequency power conditioning systems

Diode Arrays Procurement Notes

Verify the specific datasheet revision (PD-2.507 rev. A) against the manufacturer's official documentation before finalizing design specifications. Confirm that the TO-244AB isolated base configuration matches the required mounting and isolation constraints. Ensure thermal interface materials are compatible with the specified flat, greased surface requirements for optimal heat dissipation.

Diode Arrays Selection Notes

Select this component when designing systems where switching losses constitute a significant portion of total losses. The soft recovery profile is critical for minimizing voltage spikes and reducing EMI/RFI without additional snubbing components. Consider the thermal resistance values when calculating heatsink requirements for both single-leg and dual-leg conducting scenarios.

Diode Arrays Part Context

This device belongs to the HEXFRED family of ultrafast soft recovery diodes manufactured by Vishay General Semiconductor - Diodes Division. It utilizes silicon rectifier technology housed in a plastic/epoxy flange mount package. The module is designed for general-purpose applications requiring high reliability and fast switching performance.

Diode Arrays Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.

Diode Arrays FAQ

What is the maximum mounting torque for the module?

The recommended mounting torque range is between 30 and 40 lbf·in (3.4 to 4.6 N·m).

How does the reverse recovery time vary with temperature?

At TJ = 25°C, the typical reverse recovery time is 33ns, while at TJ = 125°C, it increases to a typical value of 130ns.

What is the non-repetitive avalanche energy rating?

The non-repetitive avalanche energy rating is 220 µJ, tested with L = 100µH and duty cycle limited by maximum junction temperature.