HFA120FA60

Diode Arrays Overview

The HFA120FA60 is a HEXFRED ultrafast soft recovery diode module in the SOT-227 package. It features an electrically isolated base plate for simplified mechanical designs and rapid assembly. The device provides a 600V cathode-to-anode voltage rating with a continuous forward current of 75A at 25°C case temperature. Key electrical characteristics include a typical reverse recovery time of 65ns, a peak recovery current of 7.0A, and a reverse recovery charge of 270nC. The module supports a maximum repetitive forward current of 180A.

Diode Arrays Feature Summary

• Ultrafast soft recovery characteristic for high-frequency switching applications
• Electrically isolated copper base plate enabling common heatsink usage
• Large creepage distance between terminals for enhanced safety
• Simplified mechanical design facilitating rapid assembly

Diode Arrays Applications

• Power supplies
• Battery chargers
• Electronic welders
• Motor control systems
• DC choppers and inverters

Diode Arrays Procurement Notes

Verify the specific ordering suffix to confirm the exact configuration and packaging details before procurement. Ensure that thermal interface materials are compatible with the isolated base plate surface. Confirm mounting torque specifications during installation to maintain reliable electrical isolation and thermal performance over the operating temperature range.

Diode Arrays Selection Notes

Select this component for high-current parallel rectifier applications requiring fast switching speeds. The dual-leg configuration allows for efficient current sharing in power conversion circuits. Consider the thermal resistance values when designing the heatsinking system to ensure junction temperatures remain within the specified limits under continuous operation.

Diode Arrays Part Context

This part belongs to the HEXFRED family of ultrafast rectifiers manufactured by Vishay General Semiconductor - Diodes Division. It utilizes FRED technology to achieve superior reverse recovery performance compared to standard recovery devices. The SOT-227 package format is designed for robust industrial power electronics applications requiring high current handling capabilities.

Diode Arrays Replacement Considerations

HFA120EA60

Diode Arrays FAQ

What is the difference between the HFA120FA60 and HFA120EA60 configurations?

The HFA120FA60 is a parallel configuration used for simple parallel rectifier and high current applications, while the HFA120EA60 is an antiparallel configuration intended for simple series rectifier and high voltage applications.

Is the semiconductor isolated from the base plate?

Yes, the semiconductor in the SOT-227 package is isolated from the copper base plate, allowing for common heatsinks and compact assemblies.

What is the maximum RMS isolation voltage?

The maximum RMS isolation voltage between any terminal and the case is 2500V for one minute.