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Product Detailed Parameters
- Description:DGTL ISOLTR 2.5KV 4CH GP 16-SOIC
- Series:IsoLoop®
- Mfr:NVE Corp/Isolation Products
- Package:Tube
- Number of Channels:4
- Voltage - Isolation:2500Vrms
- Rise / Fall Time (Typ):1ns, 1ns
- Operating Temperature:-40°C ~ 100°C
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.295", 7.50mm Width)
- Supplier Device Package:16-SOIC
- Grade:-
- Qualification:-
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Overview
The IL 716 is a general-purpose digital isolator from the IsoLoop series, utilizing Giant Magnetoresistive (GMR) technology. It provides 2500Vrms isolation voltage with a data rate of 110Mbps and 100kV/µs common-mode transient immunity. The device supports a supply voltage range of 3V to 5.5V and operates within a temperature range of -40°C to 100°C or 125°C depending on the specific suffix. It is available in various packages including 16-SOIC.
Feature Summary
- Utilizes GMR technology for high-speed signal transmission
- Provides reinforced isolation capabilities
- Supports bidirectional or unidirectional channel configurations
Applications
- Industrial automation systems
- Power electronics control circuits
- Medical equipment isolation barriers
Procurement Notes
Verify the specific package type and temperature rating suffix when ordering. Confirm channel configuration requirements against the datasheet. Ensure compatibility with system isolation voltage standards. Check for RoHS compliance status prior to procurement.
Selection Notes
Select based on required isolation voltage and operating temperature range. Compare GMR technology benefits against capacitive alternatives for noise immunity. Evaluate package size constraints for PCB layout. Consider propagation delay specifications for timing-critical applications.
Part Context
Part of the IsoLoop family offering magnetic isolation solutions. Designed for robust performance in noisy environments. Offers high CMTI compared to traditional technologies. Suitable for replacing optocouplers in many applications.
Replacement Considerations
Check pinout compatibility with existing designs. Verify electrical parameter equivalence for seamless integration. Review mechanical dimensions for footprint matching.
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