INA271SKGD1

Current Regulation/Management Overview

The INA271SKGD1 is a bare die current shunt monitor manufactured by Texas Instruments. It operates with a supply voltage range of 2.7 V to 18 V and supports common-mode voltages from -16 V to 80 V. The device features a fixed gain of 20 V/V, a gain bandwidth product of 130 kHz, and a maximum gain error of 0.2%. It draws 950 uA of operating current and maintains a common-mode rejection ratio of 100 dB with an input offset voltage of 2.5 mV. The component is qualified for operation between -55 C and +210 C.

Current Regulation/Management Feature Summary

• Supports high-side and low-side current sensing within an 80 V common-mode voltage range
• Provides precise amplification with a fixed 20 V/V gain and minimal gain error
• Features simplified filter inputs for easy integration into monitoring circuits

Current Regulation/Management Applications

• Automotive battery management systems
• Industrial motor control feedback loops
• High-voltage power supply current monitoring

Current Regulation/Management Procurement Notes

Verify the specific die lot and wafer map requirements with the manufacturer prior to ordering. Ensure that the substrate attachment and wire bonding processes in your assembly line are compatible with the bare die specifications. Confirm thermal dissipation capabilities under maximum load conditions to maintain reliability within the specified temperature range.

Current Regulation/Management Selection Notes

Select this component when space constraints require a bare die solution rather than a packaged IC. Consider the 130 kHz bandwidth and 2.5 mV offset voltage for applications requiring moderate speed and precision. Evaluate the -16 V to 80 V common-mode range against your system's rail voltages to ensure compatibility.

Current Regulation/Management Part Context

This part belongs to the INA271 family of current shunt monitors. Unlike packaged variants such as the INA271AIDR, the SKGD1 suffix indicates a raw silicon die intended for custom packaging or flip-chip integration. It shares the core electrical architecture of the series but requires external handling during assembly.

Current Regulation/Management Replacement Considerations

Direct replacement requires matching the die size and pad configuration. Packaged equivalents like the INA271AIDR offer similar electrical performance but differ in physical form factor and thermal management requirements.