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IR3080MPBF is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC PHASE CONTROLLER 32MLPQ. Review the specifications below when checking this part for your BOM.
The IR3080MPBF is a processor PMIC from the XPhase series, designed for phase control applications. It operates within a supply voltage range of 9.5V to 14V and draws a supply current of 11mA. The component functions across an operating temperature range of 0°C to 100°C. It is housed in a 32-MLPQ (5x5) surface-mount package with exposed pads. This integrated circuit is classified under specialized power management ICs.
Verify component status as discontinued before integration into new designs. Confirm package compatibility with existing PCB footprints. Review datasheet specifications for voltage and thermal limits. Ensure sourcing channels provide authentic Infineon products. Check for available replacement components if long-term supply is required.
Select this component for processor-centric power architectures requiring dedicated phase control. Evaluate the 32-MLPQ package constraints against board space limitations. Consider the 9.5V to 14V input range suitability for system power rails. Assess thermal performance within the specified 0°C to 100°C operational window.
The IR3080MPBF belongs to the XPhase series of power management ICs manufactured by Infineon Technologies. It serves as a specialized solution for managing power phases in processor applications. The device integrates control logic within a compact surface-mount footprint, facilitating efficient power distribution in electronic systems.
The part status is listed as discontinued. No specific public substitute part numbers are confirmed in the provided documentation. Designers should consult official Infineon resources for qualified alternatives or consider redesigning with currently active components.
The IR3080MPBF operates within a supply voltage range of 9.5V to 14V.
It utilizes a 32-MLPQ (5x5) surface-mount package with an exposed pad.
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