Memory IC IS43DR16320D-3DBLI product image

IS43DR16320D-3DBLI

$4.64
  • Description:IC DRAM 512MBIT PAR 84TWBGA
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tray

SKU:331e894fb900 Category: Brand:

  
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IS43DR16320D-3DBLI is listed in the Memory IC range at ChipApex. The manufacturer field lists ISSI, Integrated Silicon Solution Inc. Its product description is IC DRAM 512MBIT PAR 84TWBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for IS43DR16320D-3DBLI

  • Description:IC DRAM 512MBIT PAR 84TWBGA
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR2
  • Memory Size:512Mbit
  • Memory Organization:32M x 16
  • Memory Interface:Parallel
  • Clock Frequency:333 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:84-TFBGA
  • Supplier Device Package:84-TWBGA (8x12.5)
  • Access Time:450 ps
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for IS43DR16320D-3DBLI

IS43DR16320D-3DBLI

Memory IC Overview

The IS43DR16320D-3DBLI is a 512Mbit DDR2 SDRAM manufactured by ISSI. It features a 32M x 16 organization and operates at a maximum clock frequency of 333 MHz (DDR2-667). The device utilizes an 84-ball WBGA package with dimensions of 8mm x 12.5mm. Electrical specifications include a supply voltage range of 1.7V to 1.9V for VDD, VDDL, and VDDQ. The access time is specified at 450 ps, and the component supports an industrial operating temperature range from -40°C to +85°C.

Memory IC Feature Summary

  • Double data rate architecture utilizing a 4-bit prefetch design for high-speed operation
  • Supports differential data strobes and on-chip DLL for signal alignment
  • Features four internal banks enabling concurrent operations
  • Includes programmable CAS latency, additive latency, and burst lengths

Memory IC Applications

  • High-performance computing systems requiring parallel memory interfaces
  • Industrial embedded applications within specified thermal ranges
  • Automotive electronic control units meeting A1 grade requirements
  • Consumer electronics utilizing DDR2 SDRAM architectures

Memory IC Procurement Notes

Verify the specific speed grade suffix '3' corresponds to the required 333 MHz performance bin during procurement. Confirm that the 84-ball WBGA footprint matches the target PCB layout. Ensure power supply rails are stable within the 1.7V to 1.9V range to maintain SSTL_18 compliance. Check for RoHS3 certification status if environmental regulations apply to the assembly process.

Memory IC Selection Notes

Select this component when a 512Mbit capacity with a 16-bit data bus width is required. The 333 MHz speed grade suits designs not demanding the higher throughput of 400 MHz variants. Consider the 84-ball WBGA package constraints regarding board space and thermal dissipation. Verify compatibility with system controllers supporting DDR2-667 timing parameters and SSTL_18 I/O standards.

Memory IC Part Context

This part belongs to the IS43/46DR16320D series of 32Mx16 DDR2 DRAMs. It shares architectural similarities with the IS46DR16320C but differs in speed grading and package variations. The series is designed for general-purpose memory applications requiring double-data-rate transfer capabilities. ISSI provides this component as part of their broader portfolio of synchronous dynamic random-access memory solutions.

Memory IC Replacement Considerations

IS46DR16320E-3DBLA2 is listed as a parameter equivalent substitute.

IS43DR16320D-3DBLIIS43DR16320D-3DBLI
$4.64
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