IS46DR16160B-3DBLA2-TR

Memory IC Overview

The IS46DR16160B-3DBLA2-TR is an automotive-grade DDR2 SDRAM manufactured by ISSI. It features a 256 Mbit storage capacity organized as 16M x 16 bits with a 16-bit data bus width. The device supports a maximum clock frequency of 333 MHz and operates within a voltage range of 1.7 V to 1.9 V. It utilizes an 84-ball BGA package measuring 8mm x 12.5mm, ensuring surface-mount compatibility. The component is rated for extended industrial temperatures from -40°C to +105°C and includes humidity sensitivity classification.

Memory IC Feature Summary

• Automotive qualification supporting operation in high-temperature environments up to 105°C
• Double Data Rate 2 architecture enabling high-speed parallel data transfer
• Compact 84-ball BGA footprint designed for space-constrained board layouts

Memory IC Applications

• Automotive infotainment systems requiring reliable memory performance
• In-vehicle telematics units operating under strict thermal conditions
• Industrial control modules utilizing DDR2 interface standards

Memory IC Procurement Notes

Verify the specific suffix and package dimensions against the official datasheet before integration. Confirm that the 84-ball BGA layout matches your PCB design requirements. Ensure supply chain sources provide valid RoHS compliance documentation. Check for any manufacturer-specific ordering constraints or special request protocols directly with ISSI.

Memory IC Selection Notes

Select this component when automotive reliability and wide temperature tolerance are mandatory. The 16-bit interface suits applications needing balanced bandwidth without excessive pin counts. Verify system power supplies align with the 1.8V nominal requirement. Consider the 84-ball package size relative to available board real estate during initial schematic capture.

Memory IC Part Context

This part belongs to the IS46DR series of automotive DDR2 memories from ISSI. It shares architectural similarities with other devices in the family but differs in density and organization. The series targets robust embedded applications where standard commercial parts may fail under harsh environmental stress.

Memory IC Replacement Considerations

Cross-reference with other ISSI automotive DDR2 parts sharing the 84-ball BGA form factor. Verify functional equivalence regarding timing parameters and voltage levels before substitution.