Memory IC IS49RL36160-093BLI product image

IS49RL36160-093BLI

  • Description:IC DRAM 576MBIT PAR 168FBGA
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tray

SKU:bed8dc33d02a Category: Brand:

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IS49RL36160-093BLI is listed in the Memory IC range at ChipApex. The manufacturer field lists ISSI, Integrated Silicon Solution Inc. Its product description is IC DRAM 576MBIT PAR 168FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for IS49RL36160-093BLI

  • Description:IC DRAM 576MBIT PAR 168FBGA
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:DRAM
  • Memory Size:576Mbit
  • Memory Organization:16M x 36
  • Memory Interface:Parallel
  • Clock Frequency:1.066 GHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.28V ~ 1.42V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:168-LBGA
  • Supplier Device Package:168-FBGA (13.5x13.5)
  • Access Time:10 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for IS49RL36160-093BLI

IS49RL36160-093BLI

Memory IC Overview

The IS49RL36160-093BLI is a RLDRAM3 synchronous dynamic random access memory (SDRAM) manufactured by ISSI. It features a storage capacity of 576 Mbit organized as 16M x 36 with a common I/O interface. The device supports a maximum clock frequency of 1.075 GHz and operates within a supply voltage range of 1.28 V to 1.42 V. It is housed in a 168-ball FBGA package measuring 13.5x13.5 mm and functions at temperatures between 0°C and +95°C.

Memory IC Feature Summary

  • Supports high-speed parallel data transfer via the RLDRAM3 interface architecture.

Memory IC Applications

  • High-performance networking equipment requiring low-latency memory buffers.

Memory IC Procurement Notes

Verify component authenticity through authorized channels, as this specific part number is listed as obsolete or end-of-life by major distributors. Confirm that the 168-FBGA footprint matches your PCB design constraints. Ensure thermal management solutions accommodate the specified operating temperature range up to 95°C during system integration.

Memory IC Selection Notes

Select this component when designing systems requiring wide 36-bit data paths and high bandwidth capabilities provided by the RLDRAM3 technology. Consider the 168-pin package size for board space limitations. Evaluate power consumption profiles against the 1.28V to 1.42V supply requirements for compatibility with existing voltage regulation circuits.

Memory IC Part Context

This device belongs to the IS49RL36160 series of RLDRAM3 memories from ISSI. It shares architectural similarities with other parts in the family but is distinguished by its specific speed grade and package configuration. The series targets applications demanding high throughput and deterministic latency characteristics typical of enterprise-grade memory solutions.

Memory IC Replacement Considerations

The manufacturer recommends the IS49RL36160A-107EBLI as an alternative. Verify electrical compatibility and pinout correspondence before substitution.

IS49RL36160-093BLIIS49RL36160-093BLI

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