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ISL22346WFV20Z-TK is listed in the Digital Potentiometers range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC DGT POT 10KOHM 128TAP 20TSSOP. Review the specifications below when checking this part for your BOM.
The ISL22346WFV20Z-TK is a quad digitally controlled potentiometer (XDCP) from Renesas Electronics, integrating four independent potentiometers and non-volatile memory on a monolithic CMOS IC. It features 128 resistor taps per channel with a linear taper and a nominal resistance of 10 kOhms. The device operates on a single supply voltage ranging from 2.7 V to 5.5 V, with a typical supply current of 3 mA. It utilizes an I2C serial interface for wiper position control and includes three address pins to support up to eight devices on a single bus. The unit is housed in a 20-lead TSSOP package.
Verify the specific suffix 'TK' against the manufacturer's official datasheet to confirm packaging details such as reel size or cut tape specifications. Ensure the 20-TSSOP package dimensions align with the target PCB footprint. Confirm RoHS compliance status directly from the latest product documentation before procurement.
Select this component when four independent digital potentiometers are required within a single package. The 10 kOhm resistance value and 128-tap resolution suit precision adjustment needs. Verify that the I2C interface compatibility matches the host controller and that the -40°C to +125°C operating temperature range meets environmental requirements.
This part belongs to the ISL22346 series of quad digitally controlled potentiometers. It shares core electrical characteristics with variants like the ISL22346WFRT20Z but differs in physical packaging. The 'V' suffix indicates the TSSOP package, while 'TK' typically denotes the specific shipping configuration provided by the distributor.
The ISL22346WFRT20Z is listed as a parameter-equivalent alternative, offering identical electrical specifications in a 20-TQFN package. Designers must account for the mechanical footprint differences between the TSSOP and TQFN packages during substitution.
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