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ISP827X-2G is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Isocom Components 2004 LTD. Its product description is OPTOISOLATOR 5KV 2CH TRANS 8-DIP. Review the specifications below when checking this part for your BOM.
The ISP827X-2G is a high-density mounting phototransistor optically coupled isolator manufactured by Isocom Components. It features a transistor output configuration with two separate channels within a single plastic DIP-8 package. The device provides a maximum insulation voltage of 5300 Vrms, ensuring robust electrical isolation between input and output circuits. Key electrical parameters include a minimum collector-emitter breakdown voltage of 35 V, a nominal current transfer ratio of 200%, and a maximum dark power supply of 100 nA. The component supports a maximum forward current of 0.05 A and operates reliably across a wide temperature range from -55 °C to 100 °C.
Verify the specific lead form designation (STD or G) required for your assembly process, as the datasheet indicates availability in different configurations. Confirm that the 'X' suffix aligns with your specification requirements regarding approvals and packaging. Ensure compliance with RoHS directives and check for any specific handling instructions related to the plastic DIP-8 package during soldering operations.
Select this component when dual-channel isolation is necessary within a compact footprint. The 5300 Vrms rating suits applications demanding high dielectric strength. Consider the 200% nominal current transfer ratio for driving subsequent logic stages efficiently. Evaluate the operating temperature range against your environmental conditions to ensure reliability under thermal stress.
This part belongs to the ISP817/ISP827/ISP847 series of high-density mounting phototransistor optically coupled isolators. The series is designed to replace common commercial optocouplers while offering specialized parameter selection. Isocom Components manufactures these devices to meet global industry standards, providing various lead forms and custom packaging options to support diverse electronic design requirements.
Public confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing circuit designs before substitution. Consult official manufacturer resources for cross-reference lists if alternative sourcing is required.
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