Memory IC JS27HU1G08SCDA-25-SU product image

JS27HU1G08SCDA-25-SU

$1.96
  • Description:1G SLC NAND PKG 9x11mm 63FBGA
  • Series:parallel NAND
  • Mfr:Jeju Semiconductor Corp
  • Package:Bulk

SKU:5c20c114a7ba Category: Brand:

  
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JS27HU1G08SCDA-25-SU is listed in the Memory IC range at ChipApex. The manufacturer field lists Jeju Semiconductor Corp. Its product description is 1G SLC NAND PKG 9x11mm 63FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for JS27HU1G08SCDA-25-SU

  • Description:1G SLC NAND PKG 9x11mm 63FBGA
  • Series:parallel NAND
  • Mfr:Jeju Semiconductor Corp
  • Package:Bulk
  • Memory Type:-
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  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:-
  • Operating Temperature:-
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Memory IC datasheet and documents for JS27HU1G08SCDA-25-SU

JS27HU1G08SCDA-25-SU

Memory IC Overview

The JS27HU1G08SCDA-25-SU is a 1 Gbit NAND Flash memory device manufactured by Jeju Semiconductor Corp. It features an x8 I/O interface and operates with a Vcc supply voltage range of 2.7 V to 3.6 V. The component utilizes a 63-Ball FBGA package measuring 9.0 mm by 11.0 mm. It supports ONFI 1.0 compliant command sets and includes hardware data protection mechanisms. The device provides 64 bytes of spare area per page and is rated for industrial operating temperatures ranging from -40°C to 85°C.

Memory IC Feature Summary

  • Supports copy-back program operations for fast data rewriting without external buffering
  • Includes internal ECC engine providing 4-bit error correction capability
  • Features hardware write protection via the WP# pin to prevent unintended modifications
  • Offers CE don't care function allowing direct code download by microcontrollers

Memory IC Applications

  • Solid state mass storage applications
  • Industrial embedded systems requiring wide temperature tolerance
  • Consumer electronics utilizing NAND flash interfaces
  • Automotive Grade 2 compatible designs (with appropriate part selection)

Memory IC Procurement Notes

Verify that the specific ordering suffix matches the required voltage and temperature grade. Confirm the x8 interface width aligns with the system bus design. Ensure the PCB footprint accommodates the 63-ball FBGA dimensions. Check RoHS compliance documentation if environmental regulations apply to the final assembly.

Memory IC Selection Notes

Select this component when a 1 Gbit density with x8 parallel interface is required. Choose this variant over x16 versions if the system design limits available data pins. Consider the 25 ns minimum sequential access speed for performance requirements. Verify that the 2.7 V to 3.6 V supply range matches the target platform's power rails.

Memory IC Part Context

This part belongs to the JSC NAND Series, which offers cost-effective solutions for mass storage markets. The series supports densities from 1 Gbit to 8 Gbit with pinout compatibility across densities. The device architecture allows migration between different capacities without rearranging the footprint. It integrates an on-chip Program/Erase Controller to automate memory management tasks.

Memory IC Replacement Considerations

Pinout compatibility exists within the JSC NAND Series for all densities. Verify that the replacement part maintains the same x8 interface and voltage specifications. Ensure the spare area size matches the existing controller configuration. Check if the new part supports the required ONFI version.

JS27HU1G08SCDA-25-SUJS27HU1G08SCDA-25-SU
$1.96
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