JSD1G164PAH-50-SU

$3.66

Description：1G LPDDR1 PKG 8x9mm 60B BGA
Series：LPDDR1
Mfr：Jeju Semiconductor Corp
Package：Bulk

SKU:fa54122d9592 Category: Memory IC Brand: Jeju Semiconductor Corp

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Product introduction

JSD1G164PAH-50-SU is listed in the Memory IC range at ChipApex. The manufacturer field lists Jeju Semiconductor Corp. Its product description is 1G LPDDR1 PKG 8x9mm 60B BGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for JSD1G164PAH-50-SU

Description：1G LPDDR1 PKG 8x9mm 60B BGA
Series：LPDDR1
Mfr：Jeju Semiconductor Corp
Package：Bulk
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Memory IC datasheet and documents for JSD1G164PAH-50-SU

JSD1G164PAH-50-SU

Memory IC Overview

The JSD1G164PAH-50-SU is a 1Gb LPDDR SDRAM manufactured by Jeju Semiconductor Corp. It supports x16 and x32 I/O configurations with VDD and VDDQ operating between 1.7V and 1.95V. The device features a clock rate of 200MHz for the -5 speed grade, utilizing differential clock inputs (CK/CK) and bidirectional data strobes (DQS). It includes four internal banks for concurrent operation, programmable output buffer driver strength, and data mask capabilities for write operations.

Memory IC Feature Summary

Supports Partial Array Self Refresh (PASR) and Automatic Temperature Compensated Self Refresh (ATCSR) to optimize power consumption.
Features Deep Power Down Mode (DPD) and Clock Stop capability during idle periods for enhanced standby efficiency.
Includes an asynchronous temperature sensor output function (TQ pin) that signals high logic state when device temperature reaches or exceeds 85°C.

Memory IC Applications

Mobile devices requiring low-power synchronous dynamic memory
Embedded systems utilizing LPDDR interface standards
Applications necessitating partial array self-refresh capabilities

Memory IC Procurement Notes

Verify the specific speed grade suffix (-5 vs -6) against system timing requirements before procurement. Confirm package type compatibility, as x16 uses a 60-ball FPBGA while x32 utilizes a 90-ball variant. Ensure initialization sequences strictly follow the manufacturer's predefined steps to prevent undefined operation.

Memory IC Selection Notes

Select this component for designs requiring 1Gb density with flexible burst lengths and CAS latencies. Consider the TQ pin availability if thermal monitoring is required, noting it must be enabled via fuse at the chip probing stage. Evaluate the trade-off between drive strength options and load requirements for optimal signal integrity.

Memory IC Part Context

This part belongs to the JSD1GXX4PAX-SU family of 1Gb LPDDR SDRAMs. The family offers configurable interfaces supporting both x16 and x32 data widths. It is designed for mobile and embedded applications where power efficiency and high-speed data access are critical performance factors.

Memory IC Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Verify electrical and pinout compatibility with any alternative components from other manufacturers before implementation.

Memory IC FAQ

How is the temperature sensor output function (TQ) enabled?

The TQ function is default disabled and can only be enabled by a fuse at the chip probing test stage. Customers must instruct the manufacturer to enable this feature during part ordering.