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K32W1480VFTBT is listed in the RF Transceiver ICS range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC RF TXRX+MCU 802.15.4 48HVQFN. Review the specifications below when checking this part for your BOM.
The K32W1480VFTBT is an ultra-low-power, highly secure multiprotocol wireless MCU from NXP Semiconductors. It integrates an ARM Cortex-M33 core operating at 96 MHz with a 2.4 GHz RF transceiver supporting Bluetooth LE 5.2, Thread, and Zigbee protocols. The device operates on a supply voltage of 1.71 V to 3.6 V. Electrical characteristics include a receiving current of 8.7 mA and a transmitting current of 22.4 mA. It features a 48-pin HVQFN exposed pad package and supports an operating temperature range of -40°C to 105°C.
Verify the component authenticity by checking the manufacturer's part marking against official datasheet specifications. Ensure the ordering suffix matches the required package type and temperature grade. Confirm that the supplier provides traceability documentation consistent with NXP Semiconductors standards to avoid counterfeit risks in critical infrastructure deployments.
Select this component when a single-chip solution is required for multiprotocol IoT connectivity without external radios. The integrated security features make it suitable for applications demanding robust data protection. Consider the 48-pin package constraints for PCB layout and ensure the host system can support the 96 MHz processing requirements for complex protocol stacks.
This model belongs to the K32W14x family of wireless MCUs designed for low-power connectivity. It serves as a central processing unit for smart devices needing standardized wireless communication. The series emphasizes security and energy efficiency, targeting the growing market of connected consumer electronics and industrial monitoring systems requiring reliable short-range wireless links.
Consult NXP Semiconductors documentation for direct pin-compatible alternatives within the K32W14x family. Verify functional equivalence regarding supported protocols and security modules before substitution. Cross-reference package dimensions and thermal characteristics to ensure mechanical compatibility in existing designs.
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