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LA6571-TLM-E is listed in the Specialized ICS range at ChipApex. The manufacturer field lists onsemi. Its product description is IC DRIVER 36HSOPR. Review the specifications below when checking this part for your BOM.
The LA6571-TLM-E is a specialized integrated circuit driver manufactured by onsemi. It is housed in a 36-HSOP-R package, which corresponds to a 36-SOP case with a width of 0.311 inches (7.90mm) and includes an exposed pad plus two heat tabs for thermal management. The component is designed for surface-mount installation and is supplied in Tape & Reel packaging. As part of the Specialized ICs category, it functions as a dedicated driver unit. Specific electrical parameters such as voltage ratings or current capabilities are not provided in the available source data.
Verify the specific application requirements against the component's thermal design, given the exposed pad and heat tabs. Confirm that the 36-pin HSOP footprint matches the target PCB layout. Since detailed electrical specifications are not listed, ensure the driver's functional characteristics align with the system design before procurement.
Select this component when a 36-pin surface-mount driver with enhanced thermal dissipation features is required. The 36-SOP package with heat tabs suggests suitability for applications needing efficient heat transfer. Verify compatibility with the intended control signals and power supply constraints, as specific operational limits are not detailed in the provided information.
The LA6571-TLM-E belongs to onsemi's portfolio of specialized integrated circuits. It is categorized under drivers within the broader Specialized ICs segment. The 'TLM-E' suffix typically indicates a specific tape and reel packaging variant compliant with environmental standards, though exact material composition details are not specified in the local source.
No direct replacement part numbers are identified in the provided documentation. When seeking alternatives, prioritize components with identical 36-pin HSOP footprints and similar thermal pad configurations to ensure mechanical compatibility. Electrical equivalence must be verified independently as no substitute list is available.
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