LG01-1006N1LF

Common Mode Chokes Overview

The LG01-1006N1LF is a surface-mount common mode choke filter manufactured by HALO Electronics, Inc. It features a dual 1:1 gullwing configuration with an inductance of 100 µH and a maximum DC resistance of 650 mΩ. The component operates within a temperature range of -40°C to +85°C and utilizes an SMD-16 package measuring 12.7 mm in length, 7.11 mm in width, and 5.08 mm in height.

Common Mode Chokes Feature Summary

• Dual channel common mode filtering with 1:1 ratio
• Surface mount gullwing termination style
• Extended temperature operational capability

Common Mode Chokes Applications

• Signal line noise suppression
• Common mode interference reduction in electronic circuits
• EMI filtering for high-speed data interfaces

Common Mode Chokes Procurement Notes

Verify the specific part number suffix against official HALO Electronics documentation to confirm exact electrical tolerances and packaging variations. Ensure compatibility with PCB footprint dimensions and reflow soldering profiles specified in the manufacturer datasheet before integration into production designs.

Common Mode Chokes Selection Notes

Select this component when a dual-channel surface-mount solution is required for common mode noise attenuation. Consider the 100 µH inductance value and 650 mΩ DCR limits relative to circuit current requirements. Confirm that the SMD-16 gullwing package fits the available board space and thermal management constraints.

Common Mode Chokes Part Context

This component belongs to the LG series of common mode chokes from HALO Electronics, designed for surface-mount applications. The series offers various inductance values and package configurations to suit different filtering needs while maintaining consistent physical dimensions for design flexibility across multiple product lines.

Common Mode Chokes Replacement Considerations

Consult official HALO Electronics substitution guides for verified alternatives. Cross-reference inductance, DC resistance, and package dimensions to ensure functional equivalence without modifying the existing PCB layout or assembly process.