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LIA101P is listed in the Special Purpose Amplifiers range at ChipApex. The manufacturer field lists IXYS Integrated Circuits Division. Its product description is IC OPAMP ISOL 2CIR 16FLATPACK. Review the specifications below when checking this part for your BOM.
The LIA101P is a linear isolation amplifier integrating a linear optocoupler with two operational amplifiers in a single package. It utilizes a 16-pin flatpack configuration and operates within a temperature range of -40°C to +85°C. The device supports a wide power supply range of ±5V to ±18V, drawing up to 10mA per stage. Key electrical specifications include a bandwidth of at least 40kHz, a slew rate of 0.3 V/µs, and an input impedance of 10^12 Ω || 3 pF. Isolation capabilities provide 3750 VAC RMS continuous voltage between input and output.
Verify the specific suffix 'P' corresponds to the 16-pin flatpack package variant rather than standard DIP or SOIC configurations. Confirm that the component meets the required transfer gain bin (K3) specifications for your application, as devices are shipped sorted into specific gain bins. Ensure compatibility with wave soldering processes if utilizing through-hole mounting techniques.
Select this component when high linearity and precise analog signal transmission across isolation barriers are required. The integrated servo loop architecture minimizes non-linearity errors compared to discrete solutions. Consider the thermal dissipation limits and derating requirements when designing for maximum ambient temperatures near the upper operational limit.
This part belongs to the LIA100/LIA101 series of linear isolation amplifiers manufactured by IXYS Integrated Circuits Division (formerly Clare). The series is designed to replace complex discrete isolation circuits with a compact, monolithic solution. The LIA101P specifically denotes the flatpack package variation within this product family.
Direct replacements include the LIA100 and LIA101 variants which share identical electrical characteristics but differ in package type. Verify pinout compatibility and package dimensions when substituting between DIP, SOIC, and flatpack versions.
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