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LM2595T-3.3/NOPB is listed in the Voltage Regulators - DC DC Switching Regulators range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC REG BUCK 3.3V 1A TO220-5. Review the specifications below when checking this part for your BOM.
The LM2595T-3.3/NOPB is a Texas Instruments SIMPLE SWITCHER step-down switching voltage regulator in a TO-220 ZIP-5 package. It provides a fixed 3.3V output with a maximum current of 1A. The device operates from an input voltage range of 4.5V to 40V at a fixed 150kHz switching frequency. It features internal frequency compensation and a fixed-frequency current-mode control architecture for rapid transient response.
Verify the suffix 'NOPB' confirms lead-free status and RoHS compliance per manufacturer specifications. Confirm the 'T' designation indicates the TO-220 ZIP-5 through-hole package variant. Ensure the '-3.3' identifier matches the required 3.3V fixed output voltage. Cross-reference the full part number against official TI databases to validate availability and revision history before procurement.
Select this component when a robust, high-current buck converter is needed for through-hole assembly. The fixed 150kHz frequency allows for smaller passive components compared to lower-frequency alternatives. The wide input voltage range supports various supply rails. Consider thermal management requirements due to the linear-like dissipation characteristics inherent to non-synchronous designs under heavy loads.
Part of the LM2595 series, which offers higher current capability than the LM2594 but lower than the LM2596. It shares the SIMPLE SWITCHER architecture with integrated feedback and power switches. The TO-220 ZIP-5 package provides superior thermal performance compared to surface-mount variants, suitable for applications where board space is less constrained than heat dissipation.
LM2595T-ADJ/NOPB: Adjustable output version using the same package and pinout. LM2596T-3.3/NOPB: Higher current (3A) alternative with similar topology but different thermal and footprint considerations.
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